Block diagram
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Highlighted components are Nexperia focus products
Products
Design considerations
- With various radar options and multiple sensors needed for full 360 degree sensing space is extremely limited
- Move to ‘postage stamp’ radar sensor modules to save overall system space
- Move to CFP and LFPAK packages for space saving, thermal efficiency and system robustness
Driving efficiency takes pole position
Today’s cars are undergoing the greatest transformation the industry has seen. Continued electrification is resulting in significant change from the engine right through to the cloud. Consistently delivering the right functionality, with the right performance, in the right package is how Nexperia is helping ‘driving efficiency’ win.
Selection Guide 2022
The 2022 edition of the Nexperia Selection Guide presents all our Discrete, Logic and MOSFET devices in one single document to give you a complete overview of our portfolio, making it easier for you to find the right product for your design.
Improve accuracy of AOI in PCB production by using modern package technology
To enhance AOI Nexperia has introduced its new lead shape which is featured in packages such as the CFP15B and CFP2-HP. Watch this video and learn how this new lead shape delivers a more uniform solder joint which is easier to detect with AOI.
Let us help you with product and design questions
Contact our technical support desk for your technical questions.