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Chemical content 74AHC573PW

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Type numberPackagePackage descriptionTotal product weight
74AHC573PWSOT360-1TSSOP2094.94489 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352630721181512601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.6821080.100001.77166
PolymerResin systemProprietary0.4179019.900000.44015
subTotal2.10000100.000002.21181
DieDoped siliconSilicon (Si)7440-21-30.22953100.000000.24175
subTotal0.22953100.000000.24175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-835.0892097.4700036.95744
Iron (Fe)7439-89-60.864002.400000.91000
Phosphorus (P)7723-14-00.010800.030000.01138
Zinc (Zn)7440-66-60.036000.100000.03792
subTotal36.00000100.0000037.91674
Mould CompoundAdditiveNon hazardousProprietary2.585004.700002.72263
FillerSilica fused60676-86-043.4500079.0000045.76339
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-83.300006.000003.47570
PigmentCarbon black1333-86-40.110000.200000.11586
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.200004.000002.31713
Non hazardousProprietary2.255004.100002.37506
Tetramethylbiphenyl diglycidyl ether85954-11-61.100002.000001.15857
subTotal55.00000100.0000057.92834
Pre-PlatingPure metal layerGold (Au)7440-57-50.015001.000000.01580
Nickel (Ni)7440-02-01.4550097.000001.53247
Palladium (Pd)7440-05-30.030002.000000.03160
subTotal1.50000100.000001.57987
WirePure metalCopper (Cu)7440-50-80.11536100.000000.12150
subTotal0.11536100.000000.12150
total94.94489100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.