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Chemical content 74AHC86BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC86BQSOT762-1DHVQFN1421.89746 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855471151412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43164
PolymerResin systemProprietary0.0234819.900000.10724
subTotal0.11800100.000000.53888
DieDoped siliconSilicon (Si)7440-21-30.28449100.000001.29921
subTotal0.28449100.000001.29921
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.48246
Iron (Fe)7439-89-60.205522.346100.93855
Phosphorus (P)7723-14-00.002650.030200.01208
Zinc (Zn)7440-66-60.008890.101500.04060
Pure metal layerGold (Au)7440-57-50.002650.030200.01208
Nickel (Ni)7440-02-00.106921.220500.48826
Palladium (Pd)7440-05-30.004910.056000.02240
Silver (Ag)7440-22-40.001800.020500.00820
subTotal8.76000100.0000040.00463
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.68587
FillerSilica -amorphous-7631-86-90.442743.490002.02188
Silica fused60676-86-010.7602784.8200049.13933
PigmentCarbon black1333-86-40.020300.160000.09269
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62568
Epoxy resin systemProprietary0.201711.590000.92115
Phenolic resinProprietary0.285442.250001.30351
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.14355
subTotal12.68600100.0000057.93366
WirePure metalCopper (Cu)7440-50-80.0472896.550000.21593
Pure metal layerGold (Au)7440-57-50.000170.350000.00078
Palladium (Pd)7440-05-30.001523.100000.00693
subTotal0.04897100.000000.22364
total21.89746100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.