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Chemical content 74AUP1G157GX

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Type numberPackagePackage descriptionTotal product weight
74AUP1G157GXSOT1255-2X2SON60.73460 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935307358147712601235Seremban, Malaysia; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02481100.000003.37796
subTotal0.02481100.000003.37796
ComponentAdditiveNon hazardousProprietary0.000255.000000.03403
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.03403
Silica -amorphous-7631-86-90.0025050.000000.34032
PolymerEpoxy resin systemProprietary0.0015030.000000.20419
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.06806
subTotal0.00500100.000000.68063
Lead FrameCopper alloyCopper (Cu)7440-50-80.2740894.5100037.30996
Magnesium (Mg)7439-95-40.000440.150000.05922
Nickel (Ni)7440-02-00.008562.950001.16458
Silicon (Si)7440-21-30.001860.640000.25265
Pure metal layerGold (Au)7440-57-50.000060.020000.00790
Nickel (Ni)7440-02-00.004761.640000.64743
Palladium (Pd)7440-05-30.000260.090000.03553
subTotal0.29000100.0000039.47727
Mould CompoundAdditiveNon hazardousProprietary0.001630.410000.22213
FillerSilica -amorphous-7631-86-90.001150.290000.15712
Silica fused60676-86-00.3428886.1500046.67533
HardenerPhenolic resinProprietary0.017074.290002.32429
PigmentCarbon black1333-86-40.000760.190000.10294
PolymerEpoxy resin systemProprietary0.034518.670004.69733
subTotal0.39800100.0000054.17914
WireGold alloyGold (Au)7440-57-50.0166299.000002.26274
Palladium (Pd)7440-05-30.000171.000000.02286
subTotal0.01679100.000002.28560
total0.73460100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.