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Chemical content 74HC04BQ

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Type numberPackagePackage descriptionTotal product weight
74HC04BQSOT762-1DHVQFN1421.79699 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352736511151712601235Suzhou, China; Hsin-chu, Taiwan; Jiangyin, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43363
PolymerResin systemProprietary0.0234819.900000.10773
subTotal0.11800100.000000.54136
DieDoped siliconSilicon (Si)7440-21-30.18104100.000000.83058
subTotal0.18104100.000000.83058
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.65984
Iron (Fe)7439-89-60.205522.346100.94287
Phosphorus (P)7723-14-00.002650.030200.01214
Zinc (Zn)7440-66-60.008890.101500.04079
Pure metal layerGold (Au)7440-57-50.002650.030200.01214
Nickel (Ni)7440-02-00.106921.220500.49051
Palladium (Pd)7440-05-30.004910.056000.02251
Silver (Ag)7440-22-40.001800.020500.00824
subTotal8.76000100.0000040.18904
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69364
FillerSilica -amorphous-7631-86-90.442743.490002.03120
Silica fused60676-86-010.7602784.8200049.36583
PigmentCarbon black1333-86-40.020300.160000.09312
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62857
Epoxy resin systemProprietary0.201711.590000.92539
Phenolic resinProprietary0.285442.250001.30952
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15343
subTotal12.68600100.0000058.20070
WirePure metalCopper (Cu)7440-50-80.0501696.550000.23012
Pure metal layerGold (Au)7440-57-50.000180.350000.00083
Palladium (Pd)7440-05-30.001613.100000.00739
subTotal0.05195100.000000.23834
total21.79699100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.