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Chemical content 74LV14BQ

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Type numberPackagePackage descriptionTotal product weight
74LV14BQSOT762-1DHVQFN1418.27932 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855571151412601235Bangkok, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10193
PolymerResin systemProprietary0.0046319.900000.02532
subTotal0.02326100.000000.12725
DieDoped siliconSilicon (Si)7440-21-30.53212100.000002.91103
subTotal0.53212100.000002.91103
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.21677
Iron (Fe)7439-89-60.167512.400000.91639
Phosphorus (P)7723-14-00.002090.030000.01145
Zinc (Zn)7440-66-60.006980.100000.03818
subTotal6.97956100.0000038.18279
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.67475
FillerSilica -amorphous-7631-86-90.367153.490002.00854
Silica fused60676-86-08.9230684.8200048.81508
PigmentCarbon black1333-86-40.016830.160000.09208
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.62155
Epoxy resin systemProprietary0.167271.590000.91507
Phenolic resinProprietary0.236702.250001.29491
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.12940
subTotal10.52000100.0000057.55138
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00969
Nickel (Ni)7440-02-00.1612391.000000.88204
Palladium (Pd)7440-05-30.014178.000000.07754
subTotal0.17718100.000000.96927
WirePure metalCopper (Cu)7440-50-80.0455896.550000.24938
Pure metal layerGold (Au)7440-57-50.000170.350000.00090
Palladium (Pd)7440-05-30.001463.100000.00801
subTotal0.04721100.000000.25829
total18.27932100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.