×

Chemical content 74LVC14ABQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC14ABQSOT762-1DHVQFN1421.80466 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352734811152212601235Suzhou, China; Hsin-chu, Taiwan; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43348
PolymerResin systemProprietary0.0234819.900000.10769
subTotal0.11800100.000000.54117
DieDoped siliconSilicon (Si)7440-21-30.18649100.000000.85529
subTotal0.18649100.000000.85529
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.64624
Iron (Fe)7439-89-60.205522.346100.94254
Phosphorus (P)7723-14-00.002650.030200.01213
Zinc (Zn)7440-66-60.008890.101500.04078
Pure metal layerGold (Au)7440-57-50.002650.030200.01213
Nickel (Ni)7440-02-00.106921.220500.49033
Palladium (Pd)7440-05-30.004910.056000.02250
Silver (Ag)7440-22-40.001800.020500.00824
subTotal8.76000100.0000040.17489
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69304
FillerSilica -amorphous-7631-86-90.442743.490002.03049
Silica fused60676-86-010.7602784.8200049.34847
PigmentCarbon black1333-86-40.020300.160000.09309
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62835
Epoxy resin systemProprietary0.201711.590000.92507
Phenolic resinProprietary0.285442.250001.30906
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15267
subTotal12.68600100.0000058.18024
WirePure metalCopper (Cu)7440-50-80.0523096.550000.23984
Pure metal layerGold (Au)7440-57-50.000190.350000.00087
Palladium (Pd)7440-05-30.001683.100000.00770
subTotal0.05417100.000000.24841
total21.80466100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.