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Chemical content 74LVC1G00GN

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Type numberPackagePackage descriptionTotal product weight
74LVC1G00GNSOT1115X2SON60.85921 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291768132612601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02051100.000002.38753
subTotal0.02051100.000002.38753
ComponentAdditiveNon hazardousProprietary0.000255.000000.02910
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02910
Silica -amorphous-7631-86-90.0025050.000000.29096
PolymerEpoxy resin systemProprietary0.0015030.000000.17458
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05819
subTotal0.00500100.000000.58193
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.34861
Magnesium (Mg)7439-95-40.000580.150000.06721
Nickel (Ni)7440-02-00.011362.950001.32185
Silicon (Si)7440-21-30.002460.640000.28678
Pure metal layerGold (Au)7440-57-50.000080.020000.00896
Nickel (Ni)7440-02-00.006311.640000.73486
Palladium (Pd)7440-05-30.000350.090000.04033
subTotal0.38500100.0000044.80860
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20757
FillerSilica -amorphous-7631-86-90.001260.290000.14682
Silica fused60676-86-00.3747586.1500043.61594
HardenerPhenolic resinProprietary0.018664.290002.17194
PigmentCarbon black1333-86-40.000830.190000.09619
PolymerEpoxy resin systemProprietary0.037718.670004.38944
subTotal0.43500100.0000050.62790
WireGold alloyGold (Au)7440-57-50.0135699.000001.57854
Palladium (Pd)7440-05-30.000141.000000.01594
subTotal0.01370100.000001.59448
total0.85921100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.