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Chemical content 74LVC1G97GM

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Type numberPackagePackage descriptionTotal product weight
74LVC1G97GMSOT886XSON61.90028 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935293186132712601235Bangkok, Thailand; Hsin-chu, Taiwan; Seremban, Malaysia; Hefei, China; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03355100.000001.76563
subTotal0.03355100.000001.76563
ComponentAdditiveNon hazardousProprietary0.000255.000000.01316
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01316
Silica -amorphous-7631-86-90.0025050.000000.13156
PolymerEpoxy resin systemProprietary0.0015030.000000.07894
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02631
subTotal0.00500100.000000.26313
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.39525
Magnesium (Mg)7439-95-40.001160.150000.06094
Nickel (Ni)7440-02-00.022772.950001.19845
Silicon (Si)7440-21-30.004940.640000.26000
Pure metal layerGold (Au)7440-57-50.000150.020000.00813
Nickel (Ni)7440-02-00.012661.640000.66626
Palladium (Pd)7440-05-30.000690.090000.03656
subTotal0.77200100.0000040.62559
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.23000
FillerSilica -amorphous-7631-86-90.003090.290000.16268
Silica fused60676-86-00.9183686.1500048.32756
HardenerPhenolic resinProprietary0.045734.290002.40656
PigmentCarbon black1333-86-40.002030.190000.10658
PolymerEpoxy resin systemProprietary0.092428.670004.86361
subTotal1.06600100.0000056.09699
WireGold alloyGold (Au)7440-57-50.0234999.000001.23602
Palladium (Pd)7440-05-30.000241.000000.01249
subTotal0.02372100.000001.24851
total1.90028100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.