×

Chemical content 74LVC374ABQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74LVC374ABQ-Q100SOT764-1DHVQFN2028.38034 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299315115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24069
PolymerResin systemProprietary0.0169719.900000.05980
subTotal0.08528100.000000.30049
DieDoped siliconSilicon (Si)7440-21-30.34464100.000001.21437
subTotal0.34464100.000001.21437
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.99207
Iron (Fe)7439-89-60.258502.400000.91085
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03795
subTotal10.77098100.0000037.95226
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67902
FillerSilica -amorphous-7631-86-90.571483.490002.01366
Silica fused60676-86-013.8892184.8200048.93954
PigmentCarbon black1333-86-40.026200.160000.09232
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62314
Epoxy resin systemProprietary0.260361.590000.91740
Phenolic resinProprietary0.368442.250001.29821
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13483
subTotal16.37492100.0000057.69812
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07591
Nickel (Ni)7440-02-00.6628292.300002.33551
Palladium (Pd)7440-05-30.022263.100000.07844
Silver (Ag)7440-22-40.011491.600000.04049
subTotal0.71812100.000002.53035
WirePure metalCopper (Cu)7440-50-80.0834296.550000.29394
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002683.100000.00944
subTotal0.08640100.000000.30445
total28.38034100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.