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Chemical content 74VHCT02D

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Type numberPackagePackage descriptionTotal product weight
74VHCT02DSOT108-1SO14136.27945 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289661118512601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.46941
PolymerResin systemProprietary0.4975019.900000.36506
subTotal2.50000100.000001.83447
DieDoped siliconSilicon (Si)7440-21-30.39829100.000000.29226
subTotal0.39829100.000000.29226
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.48940
Iron (Fe)7439-89-61.560002.400001.14471
Phosphorus (P)7723-14-00.019500.030000.01431
Zinc (Zn)7440-66-60.065000.100000.04770
subTotal65.00000100.0000047.69612
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.34518
FillerSilica fused60676-86-053.7200079.0000039.41900
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.99385
PigmentCarbon black1333-86-40.136000.200000.09979
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.99590
Non hazardousProprietary2.788004.100002.04580
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.99795
subTotal68.00000100.0000049.89747
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21353
Palladium (Pd)7440-05-30.006002.000000.00440
subTotal0.30000100.000000.22013
WirePure metalCopper (Cu)7440-50-80.08116100.000000.05956
subTotal0.08116100.000000.05956
total136.27945100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.