Chemical content BSH201

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
BSH201	SOT23	TO-236AB	7.85821 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934054717215	13	1	260		1	235			Dongguan, China; Manchester, United Kingdom

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.25835	100.00000	3.28765
		subTotal		0.25835	100.00000	3.28765

Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.00229	0.09000	0.02919
		Carbon (C)	7440-44-0	0.00102	0.04000	0.01297
		Chromium (Cr)	7440-47-3	0.00561	0.22000	0.07136
		Cobalt (Co)	7440-48-4	0.01096	0.43000	0.13948
		Iron (Fe)	7439-89-6	1.22301	47.98000	15.56347
		Manganese (Mn)	7439-96-5	0.02192	0.86000	0.27896
		Nickel (Ni)	7440-02-0	0.92121	36.14000	11.72288
		Phosphorus (P)	7723-14-0	0.00051	0.02000	0.00649
		Silicon (Si)	7440-21-3	0.00663	0.26000	0.08434
		Sulphur (S)	7704-34-9	0.00051	0.02000	0.00649
	Pure metal layer	Copper (Cu)	7440-50-8	0.28982	11.37000	3.68813
		Silver (Ag)	7440-22-4	0.06551	2.57000	0.83364
		subTotal		2.54900	100.00000	32.43740

Mould Compound	Filler	Silica fused	60676-86-0	3.44492	71.00000	43.83848
	Pigment	Carbon black	1333-86-4	0.01456	0.30000	0.18523
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	0.95584	19.70000	12.16364
		Phenolic resin	Proprietary	0.43668	9.00000	5.55699
		subTotal		4.85200	100.00000	61.74434

Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.00001	0.00450	0.00011
		Non hazardous	Proprietary	0.00010	0.05550	0.00131
	Tin solder	Tin (Sn)	7440-31-5	0.18489	99.94000	2.35281
		subTotal		0.18500	100.00000	2.35423

Wire	Impurity	Non hazardous	Proprietary	0.00000	0.01000	0.00002
	Pure metal	Gold (Au)	7440-57-5	0.01386	99.99000	0.17636
		subTotal		0.01386	100.00000	0.17638

		total		7.85821	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.