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Chemical content NPIC6C596ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
NPIC6C596ABQ-Q100SOT763-1DHVQFN1621.80755 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9353024161151012601235Singapore, Singapore; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0720980.100000.33057
PolymerResin systemProprietary0.0179119.900000.08213
subTotal0.09000100.000000.41270
DieDoped siliconSilicon (Si)7440-21-30.91376100.000004.19012
subTotal0.91376100.000004.19012
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.7196297.4700035.39886
Iron (Fe)7439-89-60.190082.400000.87162
Phosphorus (P)7723-14-00.002380.030000.01090
Zinc (Zn)7440-66-60.007920.100000.03632
subTotal7.92000100.0000036.31770
Mould CompoundFillerSilica -amorphous-7631-86-91.001497.980004.59240
Silica fused60676-86-010.0515580.0920046.09205
PigmentCarbon black1333-86-40.116460.928000.53405
PolymerEpoxy resin systemProprietary1.060488.450004.86288
Phenolic resinProprietary0.320022.550001.46750
subTotal12.55000100.0000057.54888
Pre-PlatingPure metal layerGold (Au)7440-57-50.008103.000000.03714
Nickel (Ni)7440-02-00.2492192.300001.14277
Palladium (Pd)7440-05-30.008373.100000.03838
Silver (Ag)7440-22-40.004321.600000.01981
subTotal0.27000100.000001.23810
WirePure metalCopper (Cu)7440-50-80.06379100.000000.29251
subTotal0.06379100.000000.29251
total21.80755100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.