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Chemical content PMDPB56XNEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDPB56XNEASOT1118DHUSON67.23680 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934069878115212601235Kwai Chung, Hong Kong; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01078
FillerSilver (Ag)7440-22-40.0655284.000000.90537
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10778
Isobornyl Methacrylate7534-94-30.003905.000000.05389
subTotal0.07800100.000001.07782
DieDoped siliconSilicon (Si)7440-21-30.30000100.000004.14548
subTotal0.30000100.000004.14548
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100035.36660
Magnesium (Mg)7439-95-40.005380.200000.07437
Nickel (Ni)7440-02-00.085303.170001.17876
Silicon (Si)7440-21-30.018570.690000.25658
Pure metal layerGold (Au)7440-57-50.000540.020000.00744
Nickel (Ni)7440-02-00.019910.740000.27517
Palladium (Pd)7440-05-30.001880.070000.02603
subTotal2.69100100.0000037.18495
Mould CompoundFillerSilica -amorphous-7631-86-90.8942423.0000012.35684
Silica fused60676-86-02.3328060.0000032.23524
Flame retardantMetal hydroxideProprietary0.116643.000001.61176
ImpurityBismuth (Bi)7440-69-90.019440.500000.26863
PigmentCarbon black1333-86-40.019440.500000.26863
PolymerEpoxy resin systemProprietary0.272167.000003.76078
Phenolic resinProprietary0.233286.000003.22352
subTotal3.88800100.0000053.72540
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00126
Tin solderTin (Sn)7440-31-50.1639099.940002.26484
subTotal0.16400100.000002.26620
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalGold (Au)7440-57-50.0112099.990000.15475
subTotal0.01120100.000000.15477
WirePure metalGold (Au)7440-57-50.10460100.000001.44545
subTotal0.10460100.000001.44545
total7.23680100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.