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Chemical content PMDXB950UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMDXB950UPESOT1216DFN1010B-61.20610 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067656147612601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000201.000000.01658
FillerSilver (Ag)7440-22-40.0168084.000001.39292
PolymerBismaleimidodiphenylmethane resin 0.0020010.000000.16582
Isobornyl Methacrylate7534-94-30.001005.000000.08291
subTotal0.02000100.000001.65823
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.97471
subTotal0.06000100.000004.97471
Lead FrameCopper alloyChromium (Cr)7440-47-30.001180.240000.09750
Copper (Cu)7440-50-80.4649694.8900038.55078
Tin (Sn)7440-31-50.001180.240000.09750
Zinc (Zn)7440-66-60.001030.210000.08532
Pure metal layerGold (Au)7440-57-50.000240.050000.02031
Nickel (Ni)7440-02-00.020584.200001.70633
Palladium (Pd)7440-05-30.000830.170000.06907
subTotal0.49000100.0000040.62681
Mould CompoundFillerSilica -amorphous-7631-86-90.1403023.0000011.63253
Silica fused60676-86-00.3660060.0000030.34574
Flame retardantMetal hydroxideProprietary0.018303.000001.51729
ImpurityBismuth (Bi)7440-69-90.003050.500000.25288
PigmentCarbon black1333-86-40.003050.500000.25288
PolymerEpoxy resin systemProprietary0.042707.000003.54034
Phenolic resinProprietary0.036606.000003.03457
subTotal0.61000100.0000050.57623
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000010.055500.00092
Tin solderTin (Sn)7440-31-50.0199999.940001.65724
subTotal0.02000100.000001.65823
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0061099.990000.50571
subTotal0.00610100.000000.50576
total1.20610100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.