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Chemical content PMEG2005BELD

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMEG2005BELDSOD882DDFN1006-20.73789 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066026315812601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.30899
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04257
Phenolic resinProprietary0.0004113.530000.05501
subTotal0.00300100.000000.40657
DieDoped siliconSilicon (Si)7440-21-30.08000100.0000010.84172
subTotal0.08000100.0000010.84172
Lead FrameCopper alloyChromium (Cr)7440-47-30.000800.257500.10888
Copper (Cu)7440-50-80.2957694.7950040.08191
Tin (Sn)7440-31-50.000750.238800.10097
Zinc (Zn)7440-66-60.000600.190800.08068
Pure metal layerGold (Au)7440-57-50.000170.055000.02326
Nickel (Ni)7440-02-00.013394.292001.81477
Palladium (Pd)7440-05-30.000530.170900.07226
subTotal0.31200100.0000042.28273
Mould CompoundFillerSilica -amorphous-7631-86-90.0687723.000009.31982
Silica fused60676-86-00.1794060.0000024.31257
Flame retardantMetal hydroxideProprietary0.008973.000001.21563
ImpurityBismuth (Bi)7440-69-90.001500.500000.20260
PigmentCarbon black1333-86-40.001500.500000.20260
PolymerEpoxy resin systemProprietary0.020937.000002.83647
Phenolic resinProprietary0.017946.000002.43126
subTotal0.29900100.0000040.52095
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00165
Tin solderTin (Sn)7440-31-50.0219999.940002.97969
subTotal0.02200100.000002.98147
WireImpurityNon hazardousProprietary0.000000.010000.00030
Pure metalGold (Au)7440-57-50.0218999.990002.96600
subTotal0.02189100.000002.96630
total0.73789100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.