×

Chemical content PMZB670UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMZB670UPESOT883BXQFN30.70026 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065872315712601235Kyoto, Japan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32559
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04485
Phenolic resinProprietary0.0004113.530000.05796
subTotal0.00300100.000000.42840
DieAluminium alloyAluminium (Al)7429-90-50.003226.430000.45912
Doped siliconSilicon (Si)7440-21-30.0455291.030006.49973
Gold alloyGold (Au)7440-57-50.001272.540000.18136
subTotal0.05000100.000007.14021
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09596
Copper (Cu)7440-50-80.2632094.0000037.58604
Tin (Sn)7440-31-50.000670.240000.09596
Zinc (Zn)7440-66-60.000590.210000.08397
Pure metal layerGold (Au)7440-57-50.000220.080000.03199
Nickel (Ni)7440-02-00.013834.940001.97527
Palladium (Pd)7440-05-30.000810.290000.11596
subTotal0.28000100.0000039.98515
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.16728
Silica fused60676-86-00.2040060.0000029.13204
Flame retardantMetal hydroxideProprietary0.010203.000001.45660
ImpurityBismuth (Bi)7440-69-90.001700.500000.24277
PigmentCarbon black1333-86-40.001700.500000.24277
PolymerEpoxy resin systemProprietary0.023807.000003.39874
Phenolic resinProprietary0.020406.000002.91320
subTotal0.34000100.0000048.55340
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00159
Tin solderTin (Sn)7440-31-50.0199999.940002.85437
subTotal0.02000100.000002.85609
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0072699.990001.03651
subTotal0.00726100.000001.03661
total0.70026100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.