Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT370-1 | SSOP48 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | MO-118 (JEDEC) | 2003-02-19 |
Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SOT370-1_118 | SSOP48; Reel pack for SMD, 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|