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PMCM6501UNE

20 V, N-channel Trench MOSFET

N-channel enhancement mode Field-Effect Transistor (FET) in a 6 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.

This product has been discontinued, click here for discontinuation information and replacement parts.

Features and benefits

  • Low threshold voltage

  • Ultra small package: 0.98 × 1.48 × 0.35 mm

  • Trench MOSFET technology

  • ElectroStatic Discharge (ESD) protection > 2 kV HBM

Applications

  • Relay driver

  • High-speed line driver

  • Low-side loadswitch

  • Switching circuits

Parametrics

Type number Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 4.5 V (mΩ) RDSon [max] @ VGS = 2.5 V (mΩ) integrated gate-source ESD protection diodes Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMCM6501UNE WLCSP6_3-2 WLCSP6 End of life N 1 20 8 21 25 Y 150 8.7 5.8 19 0.556 0.6 N 1050 190 2017-04-17

Package

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PMCM6501UNE PMCM6501UNEZ
(934070323023)		 Discontinued / End-of-life AE WLCSP6_3-2
WLCSP6
(WLCSP6_3-2) 		WLCSP6_3-2 Not available

Environmental information

All type numbers in the table below are discontinued. See the table Discontinuation information for more information.

Type number Orderable part number Chemical content RoHS RHF-indicator
PMCM6501UNE PMCM6501UNEZ PMCM6501UNE rohs rhf rhf
Quality and reliability disclaimer

Series

Documentation (15)

File name Title Type Date
PMCM6501UNE 20 V, N-channel Trench MOSFET Data sheet 2023-06-02
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13
nexperia_document_leaflet_SsMOS_for_mobile_2022-CHN 适合移动和便携式设备的 大批量小信号MOSFET， 采用WLCSP和无引脚DFN封装 Leaflet 2022-07-04
nexperia_document_leaflet_SsMOS_for_mobile_2022 High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages Leaflet 2022-07-04
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
nexperia_document_leaflet_WLCSP_201803 Small-signal MOSFETs in WLCSP - Smallest size - lowest RDS(on) Leaflet 2018-04-25
nexperia_document_leaflet_WLCSP_201803_CHN WLCSP Chinese Translation Leaflet 2018-04-25
WLCSP6_3-2 wafer level chip-size package; 6 bumps (3 x 2) Package information 2022-07-13
pmcm4401vne-ssmos_fr pmcm4401vne-ssmos_fr Reflow soldering 2015-07-10
PMCM6501UNE_06_01_2017 PMCM6501UNE SPICE model SPICE model 2017-10-21
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
PMCM6501UNE_06_01_2017 PMCM6501UNE SPICE model SPICE model 2017-10-21
WLCSP6_3-2 3D model for products with WLCSP6_3-2 package Design support 2023-03-13

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet