BCP53

80 V, 1 A PNP medium power transistor

PNP medium power transistor in a SOT223 Surface-Mounted Device (SMD) plastic package. NPN complement: BCP56.

Features

  • High current
  • Three current gain selections
  • High power dissipation capability
  • AEC-Q101 qualified

Target applications

  • Linear voltage regulators
  • High-side switches
  • Battery-driven devices
  • Power management
  • MOSFET drivers
  • Amplifiers

Parametrics

Type numberPackage versionPackage nameSize (mm)
BCP53SOT223SC-736.5 x 3.5 x 1.65

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
BCP53
SC-73
(SOT223)
SOT223Reflow_Soldering_Profile
Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP53BCP53F
( 9339 173 30135 )
Reel 7" Q1/T1ActiveBCP53BCP53,115
( 9339 173 30115 )

Quality

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
BCP53BCP53FBCP53153.00.711.41E9
BCP53BCP53,115BCP53week 34, 2003153.00.711.41E911
Quality and reliability disclaimer

Documentation (12)

File nameTitleTypeDate
BCP53_BCX53_BC53PA80 V, 1 A PNP medium power transistorsData sheet2016-08-01
AN10405Increased circuit efficiency, less required board space and saved money by replacing power transistors with low VCEsat (BISS) transistorsApplication note2006-01-05
LSYMTRALetter Symbols - Transistors; GeneralDesign support1999-05-06
75017660Medium-power general-purpose transistorsLeaflet2015-05-26
BCP53_Nexperia_Product_QualityBCP53 Nexperia Product QualityQuality document2017-05-16
BCP53_Nexperia_Product_ReliabilityBCP53 Nexperia Product ReliabilityQuality document2017-05-23
BCP53BCP53 SPICE modelSPICE model2012-07-22
SOT223_115Tape reel SMD; standard product orientation 12NC ending 115Packing2012-11-07
SOT223_135Tape reel SMD; standard product orientation 12NC ending 135Packing2012-11-07
Reflow_Soldering_ProfileReflow Soldering ProfileReflow soldering2013-12-23
Wave_Soldering_ProfileWave Soldering ProfileWave soldering2013-09-29
SOT223plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm bodyOutline drawing2017-01-30

Support

Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.

Models

File nameTitleTypeDate
BCP53BCP53 SPICE modelSPICE model2012-07-22

Ordering

DistributorBuy online
Arrow ElectronicsBuy online
Avnet ExpressBuy online
Chip One StopBuy online
DigiKeyBuy online
Farnell EuropeBuy online
Future ElectronicsBuy online
Mouser ElectronicsBuy online
NewarkBuy online
Newark element14Buy online

Sample

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