PBSS5330PA

30 V, 3 A PNP low VCEsat (BISS) transistor

PNP low VCEsat Breakthrough In Small Signal (BISS) transistor, encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.

NPN complement: PBSS4330PA.

Features

  • Low collector-emitter saturation voltage VCEsat
  • High collector current capability IC and ICM
  • Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
  • Exposed heat sink for excellent thermal and electrical conductivity
  • Leadless small SMD plastic package with medium power capability

Target applications

  • Loadswitch
  • Battery-driven devices
  • Power management
  • Charging circuits
  • Power switches (e.g. motors, fans)

Parametrics

Type numberPackage versionPackage nameSize (mm)transistor polarityPtot [max] (mW)VCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]hFE [typ]fT [min] (MHz)fT [typ] (MHz)RCEsat [typ] (mΩ)RCEsat [max] (mΩ)VCEsat [max] (mV)
PBSS5330PASOT1061DFN2020-32 x 2 x 0.65PNP2100-30-3-520032010016575107-320

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
PBSS5330PA
DFN2020-3
(SOT1061)
SOT1061Reflow_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveAJPBSS5330PA,135
( 9340 642 73135 )
Reel 7" Q1/T1ActiveAJPBSS5330PA,115
( 9340 642 73115 )

Quality

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
PBSS5330PAPBSS5330PA,135PBSS5330PAAlways Pb-free153.00.711.41E911
PBSS5330PAPBSS5330PA,115PBSS5330PAAlways Pb-free153.00.711.41E911
Quality and reliability disclaimer

Documentation (10)

File nameTitleTypeDate
PBSS5330PA30 V, 3 A PNP low VCEsat (BISS) transistorData sheet2017-05-04
AN10910Protecting charger interfaces and typical battery charging topologies with external bypass transistorsApplication note2011-07-01
AN11045Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductorsApplication note2013-03-04
AN11076Thermal behavior of small-signal discretes on multilayer PCBsApplication note2011-07-12
939775017444Discretes for portable devices and mobile handsetsBrochure2013-09-03
PBSS5330PAPBSS5330PA SPICE modelSPICE model2012-07-22
SOT1061_115DFN2020-3; reel pack; standard product orientation; 12NC ending 115Packing2012-11-07
SOT1061_135DFN2020-3; Standard orientation; 12NC ending 135Packing2012-11-07
Reflow_Soldering_ProfileReflow Soldering ProfileReflow soldering2013-12-23
SOT1061plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyOutline drawing2017-01-30

Support

Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.

Models

File nameTitleTypeDate
PBSS5330PAPBSS5330PA SPICE modelSPICE model2012-07-22

Ordering

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