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GAN3R2-100CBE

100 V, 3.2 mOhm Gallium Nitride (GaN) FET in a 3.5 mm x 2.13 mm Wafer Level Chip-Scale Package (WLCSP)

The GAN3R2-100CBE is a a general purpose 100 V, 3.2 mΩ Gallium Nitride (GaN) FET in a 15 bump Wafer Level Chip-Scale Package (WLCSP). It is a normally-off e-mode device offering superior performance.

Features and benefits

  • Enhancement mode - normally-off power switch

  • Ultra high frequency switching capability

  • No body diode

  • Low gate charge, low output charge

  • Qualified for standard applications

  • ESD protection

  • RoHS, Pb-free, REACH-compliant

  • High efficiency and high power density

  • Wafer Level Chip-Scale Package (WLCSP) 3.5 mm x 2.13 mm

Applications

  • High power density and high efficiency power conversion

  • AC-to-DC converters, (secondary stage)

  • High frequency DC-to-DC converters in 48 V systems

  • Fast battery charging, mobile phone, laptop, tablet and USB type-C chargers

  • Datacom and telecom (AC-to-DC and DC-to-DC) converters

  • Motor drives

  • LiDAR (non-automotive)

  • Class D audio amplifiers

Parametrics

Type number Package version Package name Product status Configuration Channel type Nr of transistors VDS [max] (V) RDSon [max] @ VGS = 5 V (mΩ) Tj [max] (°C) QGD [typ] (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
GAN3R2-100CBE WLCSP8-SOT8072 WLCSP8 Production e-mode N 1 100 3.2 150 1.7 394 1.1 N 999.99994 460 2023-02-22

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
GAN3R2-100CBE GAN3R2-100CBEAZ
(934665899341)		 Active 3R2DCBE WLCSP8-SOT8072
WLCSP8
(WLCSP8-SOT8072) 		WLCSP8-SOT8072 WLCSP8-SOT8072_341

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
GAN3R2-100CBE GAN3R2-100CBEAZ GAN3R2-100CBE rohs rhf rhf
Quality and reliability disclaimer

Documentation (21)

File name Title Type Date
GAN3R2-100CBE 100 V, 3.2 mOhm Gallium Nitride (GaN) FET in a 3.5 mm x 2.13 mm Wafer Level Chip-Scale Package (WLCSP) Data sheet 2023-04-27
AN90004 Probing considerations for fast switching applications Application note 2019-11-15
AN90005 Understanding Power GaN FET data sheet parameters Application note 2020-06-08
AN90006 Circuit design and PCB layout recommendations for GaN FET half bridges Application note 2019-11-15
AN90021 Power GaN technology: the need for efficient power conversion Application note 2020-08-14
AN90041 Gate drive circuit design for Nexperia 650 V Enhancement mode (e-mode) GaN FETs Application note 2023-05-09
WLCSP8-SOT8072 3D model for products with WLCSP8-SOT8072 package Design support 2023-04-13
2023_0001_NEX_150_Leaflet_update_Power_GaN_FETs Leaflet Power GaN FETs Leaflet 2023-10-24
nexperia_document_leaflet_GaN_FETs_2023 Power GaN FETs leaflet Leaflet 2025-01-10
WLCSP8-SOT8072 wafer level chip-scale package; 8 solder bars; body: 3.5 x 2.13 x 0.429 mm Package information 2023-03-21
WLCSP8-SOT8072_341 WLCSP8; Reel dry pack for SMD, 7"; Q2/T3 product orientation Packing information 2023-04-18
GAN3R2-100CBE GAN3R2-100CBE SPICE model SPICE model 2023-04-12
TN90004 An insight into Nexperia Power GaN technology – Applications, quality, reliability and scalability Technical note 2020-07-21
CauerModel_GAN3R2-100CBE Cauer model GAN3R2-100CBE Thermal model 2023-04-12
FosterModel_GAN3R2-100CBE Foster model GAN3R2-100CBE Thermal model 2023-04-12
GAN3R2-100CBE GAN3R2-100CBE RC thermal model Thermal model 2023-04-12
GAN3R2-100CBE_Cauer GAN3R2-100CBE Cauer model Thermal model 2023-04-12
GAN3R2-100CBE_Foster GAN3R2-100CB Foster model Thermal model 2023-04-12
nexperia_whitepaper_gan_need_for_efficient_conversion White paper: Power GaN technology: the need for efficient power conversion White paper 2020-07-23
nexperia_whitepaper_gan_need_for_efficient_conversion_CHN 白皮书: 功率GaN技术： 高效功率转换的需求 White paper 2020-08-17
nexperia_whitepaper_gan_need_for_efficient_conversion_Japanese Whitepaper: GaN need for efficient conversion (Japanese) White paper 2021-05-20

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
WLCSP8-SOT8072 3D model for products with WLCSP8-SOT8072 package Design support 2023-04-13
GAN3R2-100CBE GAN3R2-100CBE SPICE model SPICE model 2023-04-12
CauerModel_GAN3R2-100CBE Cauer model GAN3R2-100CBE Thermal model 2023-04-12
FosterModel_GAN3R2-100CBE Foster model GAN3R2-100CBE Thermal model 2023-04-12
GAN3R2-100CBE GAN3R2-100CBE RC thermal model Thermal model 2023-04-12
GAN3R2-100CBE_Cauer GAN3R2-100CBE Cauer model Thermal model 2023-04-12
GAN3R2-100CBE_Foster GAN3R2-100CB Foster model Thermal model 2023-04-12

Ordering, pricing & availability

Type number Orderable part number Ordering code (12NC) Status Packing Packing Quantity Buy online
GAN3R2-100CBE GAN3R2-100CBEAZ 934665899341 Active WLCSP8-SOT8072_341 1,500 Order product

Sample

As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.

Sample orders normally take 2-4 days for delivery.

If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet

Orderable parts

Type number Orderable part number Ordering code (12NC) Package Buy from distributors
GAN3R2-100CBE GAN3R2-100CBEAZ 934665899341 WLCSP8-SOT8072 Order product