N-channel TrenchMOS logic level FET

Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product has been designed and qualified to the appropriate AEC standard for use in automotive critical applications.


  • Low conduction losses due to low on-state resistance
  • Q101 compliant
  • Suitable for logic level gate drive sources
  • Suitable for thermally demanding environments due to 175 °C rating

Target applications

  • 12 V, 24 V and 42 V loads
  • Automotive systems
  • DC-to-DC converters
  • Engine management
  • General purpose power switching
  • Motors, lamps and solenoids
  • Transmission control


Type numberPackage versionPackage nameProduct statusChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)ID [max] (A)QGD [typ] (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
BUK9Y19-75BSOT669LFPAK56; Power-SO8ProductionN17518192148.2121061451.65Y23222582011-01-27


Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
LFPAK56; Power-SO8
SOT669Reel 7" Q1/T1Active91975BBUK9Y19-75B,115
( 9340 633 05115 )


Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL leadfree
Quality and reliability disclaimer

Documentation (22)

File nameTitleTypeDate
BUK9Y19-75BN-channel TrenchMOS logic level FETData sheet2010-04-13
AN10273Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication note2015-12-10
AN10874LFPAK MOSFET thermal design guideApplication note2011-01-27
AN11113LFPAK MOSFET thermal design guide - Part 2Application note2011-11-16
AN11158Understanding power MOSFET data sheet parametersApplication note2014-02-04
AN11160Designing RC SnubbersApplication note2012-10-01
AN11156Using Power MOSFET Zth CurvesApplication note2012-10-10
AN11243Failure signature of Electrical Overstress on Power MOSFETsApplication note2012-10-29
AN11261Using RC Thermal ModelsApplication note2014-05-19
AN11599Using power MOSFETs in parallelApplication note2016-07-13
939775016838_LRLFPAK - The Toughest Power SO8Leaflet2010-03-17
939775016899_LRHigh reliability LFPAK MOSFETs for Automotive Power ApplicationsLeaflet2010-03-18
R_10067High Efficiency HVAC blower motor controlReport2016-04-14
75017643Automotive MOSFET Selection Guide 2016: Performance, Quality, ReliabilitySelection guide2016-03-31
75017631Discretes Semiconductors Selection Guide 2016Selection guide2016-02-16
BUK9Y19_75BBUK9Y19-75B SPICE modelSPICE model2012-04-11
BUK9Y19_75BBUK9Y19-75B Spice modelSPICE model2014-03-03
TN00008Power MOSFET frequently asked questions and answersTechnical note2016-10-31
BUK9Y19-75B_RC_Thermal_ModelBUK9Y19-75B_RC_Thermal_ModelThermal design2010-03-29
BUK9Y19-75BBUK9Y19-75B Thermal modelThermal model2009-06-22
SOT669_115LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115Packing2016-09-09
SOT669plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm bodyOutline drawing2017-01-31


Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.


File nameTitleTypeDate
BUK9Y19_75BBUK9Y19-75B SPICE modelSPICE model2012-04-11
BUK9Y19_75BBUK9Y19-75B Spice modelSPICE model2014-03-03
BUK9Y19-75B_RC_Thermal_ModelBUK9Y19-75B_RC_Thermal_ModelThermal design2010-03-29
BUK9Y19-75BBUK9Y19-75B Thermal modelThermal model2009-06-22


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