PSMN6R0-30YLD

N-channel 30 V, 6.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology

Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.

Features

  • Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
  • Superfast switching with soft-recovery; s-factor > 1
  • Low spiking and ringing for low EMI designs
  • Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C
  • Optimised for 4.5 V gate drive
  • Low parasitic inductance and resistance
  • High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175 °C
  • Wave solderable; exposed leads for optimal visual solder inspection

Target applications

  • On-board DC-to-DC solutions for server and telecommunications
  • Secondary-side synchronous rectification in telecommunication applications
  • Voltage regulator modules (VRM)
  • Point-of-Load (POL) modules
  • Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
  • Brushed and brushless motor control

Parametrics

Type numberPackage nameProduct statusChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] @ VGS = 10 V (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PSMN6R0-30YLDLFPAK56; Power-SO8ProductionN13068.35175662.16.714.14712.61.83N8325872013-06-26

Package

Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
PSMN6R0-30YLD
LFPAK56; Power-SO8
(SOT669)
SOT669Reel 7" Q1/T1Active6D030LPSMN6R0-30YLDX
( 9340 677 97115 )

Quality

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL leadfree
PSMN6R0-30YLDPSMN6R0-30YLDXPSMN6R0-30YLD11
Quality and reliability disclaimer

Documentation (13)

File nameTitleTypeDate
PSMN6R0-30YLDN-channel 30 V, 6.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 TechnologyData sheet2017-04-11
AN10874LFPAK MOSFET thermal design guideApplication note2011-01-27
AN11113LFPAK MOSFET thermal design guide - Part 2Application note2011-11-16
AN11261Using RC Thermal ModelsApplication note2014-05-19
AN11599Using power MOSFETs in parallelApplication note2016-07-13
75017631Discretes Semiconductors Selection Guide 2016Selection guide2016-02-16
75017590NXP's Power MOSFET Selection Guide 2014: Smaller, faster, coolerSelection guide2014-09-10
PSMN6R0-30YLDPSMN6R0-30YLD Spice modelSPICE model2013-09-17
TN00008Power MOSFET frequently asked questions and answersTechnical note2016-10-31
PSMN6R0-30YLD_RC_Thermal_ModelPSMN6R0-30YLD Thermal design modelThermal design2015-11-23
PSMN6R0-30YLDPSMN6R0-30YLD Thermal modelThermal model2013-09-17
SOT669_115LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115Packing2016-09-09
SOT669plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm bodyOutline drawing2017-01-31

Support

Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.

Models

File nameTitleTypeDate
PSMN6R0-30YLDPSMN6R0-30YLD Spice modelSPICE model2013-09-17
PSMN6R0-30YLD_RC_Thermal_ModelPSMN6R0-30YLD Thermal design modelThermal design2015-11-23
PSMN6R0-30YLDPSMN6R0-30YLD Thermal modelThermal model2013-09-17

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