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Session 1: Choosing optimal dynamic characteristics for ESD protection of compact systems using SEED simulation

In this presentation the system-level impact of dynamic ESD protection device characteristics is analysed. First, the difference between quasi-static and dynamic behaviour for different technologies is demonstrated by detailed evaluation of TLP measurements. Finally, the impact of device dynamics is analysed using fully dynamic system-level SEED simulation approach applied to the example of a compact system with the ESD protection device (TVS) close to the IC, resulting in a reduced trace inductance.

Session 2: 3D fullwave simulation for system level ESD

The presentation will focus on system level ESD using 3D fullwave simulation. The general description of simulation workflow, simulation model consideration and the simulation technique will be briefly discussed in this presentation. Finally, an example of ESD contact discharge simulation of automotive ethernet will be presented to show the advantage of using 3D fullwave simulation.