Advanced LFPAK MOSFETs technology for a higher power density

June, 21st, 2019 - In Power Electronics News, Nexperia’s advanced LFPAK MOSFETs’ characteristics and applications are detailed. Find out how LFPAK88 and other members of the LFPAK family bring value to Industrial and Automotive designs, by minimizing footprint and increasing power density.

Read the article in: Power Electronics News

Nexperia: Power technology on display at PCIM Nuremberg

May 17th, 2019 – Nexperia achieves higher power density through packaging. Read more about the LFPAK technology that was presented at PCIM trade show in Nuremberg.

Read the article in: EEWorld / Power electronic tips

Nexperia has achieved great results – first company presence at Electronica China trade show

March 26th, 2019 – Interview with Paul Zhang (Nexperia’s SVP of Sales Greater China & General Manager of China) at the company’s first presence at Electronica China in Shanghai. Read about what Paul says about Nexperia’s strong performance in its first 2 years, the management strategy for future growth and business development in China.

Read the article in: AET China (Chinese)

Why Trench Schottky rectifiers are the preferred choice

March 3rd, 2019 – To achieve a highly efficient design we try to utilize the most ideal solution possible. Nexperia’s Trench Schottky rectifiers take us close to that ideal solution by demonstrating low losses, stability against thermal runaway and an excellent EMC performance.

Read the article in: EETimes China (Chinese) or EEPower (English)

Nexperia Achieves 35% Revenue Growth in First Two Years as a Standalone Company

February 7th, 2019 – In just two years as independent company, Nexperia significantly out-performed the market, achieved growth figures of over 35%, introduced more new products and expanded its annual manufacturing capacity to more than 100 billion parts.

Read the article in: Global Banking and Finance, Elektronik (German), Electronique (French), ESM (Chinese)

Nexperia aims to increase sales by 20% in 2019

November 29th, 2018 – EETimes Japan interview with CEO Frans Scheper and Kazunari Kuniyoshi, Head & Senior Director Sales Japan about Nexperia’s strong performance in its first 18 months, the management strategy for future growth and business development in Japan. Read about the importance of capital investments, the automotive market and Nexperia’s ambitions in the area of power discretes.

Read the article in: EETimes Japan

Company value almost doubled. Wingtech buys majority stake in Nexperia

October 25th, 2018 - The Chinese Wingtech Technology wants to acquire the majority of Nexperia, which was spun off from NXP last year. Through the purchase Wingtech wants to gain access to the automotive market, the largest business area of ​​Nexperia.

Read the article in: Markt & Technik

Design Challenges Posed by USB 3.2

August 3rd, 2018 - Double data rates and no expenditure required to replace USB Type-C cables should mean that USB 3.2 is a dream come true. It mostly is, but the fast, convenient USB upgrade does present some design challenges. Read about USB 3.2 / USB Type-C and how Nexperia is providing optimized ESD and surge protection solutions for these new standards.

Read the article in: Embedded Systems Engineering powered by EECatalog

Interview with Nexperia CEO Frans Scheper on Dutch Business News Radio

On February 28, Nexperia CEO Frans Scheper had an interview on Dutch Business News Radio. Worth listening! 

Watch the interview with Frans