Nov 19th, 2019 – Nexperia announced its entry into the gallium nitride (GaN) FET market with the introduction of the 650 volt GAN063-650WSA. Read more about this strategic step and the new product.
Read in: PowerPulse.net
Nov 12th, 2019 – As the amount of advanced driver-assistance systems (ADAS) in vehicles increase, so does the requirement to innovate semiconductors to increase safety, reduce size, and complexity. This article is part of a series about ADAS and Autonomous Vehicles.
Read in: Wevolver platform
Sep 6th, 2019 – Technical article exploring the significance of the parameter reverse recovery charge Qrr.
Aug 20th, 2019 - Combination and configurable logic devices provide the flexibility to implement various logic functions with a reduced pin count, can lower system cost, simplify inventory & assembly, and improve the qualification process. Find out how to design more with less.
Read in: PowerPulse.net
Aug 16th, 2019 – LEDs are widely used across all market segments. The vast majority of applications use LEDs with currents below 500 mA. This technical article discusses design and power considerations necessary to use constant-current LED drivers.
July 26th, 2019 – The Supplier of the Year Award is given to those who have made an outstanding contribution to customer satisfaction at all levels – quality, technology, engagement, costs and purchasing conditions. Read more about the background and the 14 product categories in which the Continental awards were presented. Nexperia is proud winner in the category Electronics (discretes).
July 11th, 2019 – Nexperia received a Bosch Global Supplier Award in the category ‘Purchasing of direct materials – Mobility Solutions’. Nexperia was one of only 47 companies from Bosch’s 43,000-strong supplier base to be honored with such an award for its outstanding performance and teamwork in 2017-2018.
Read in: EEPower
June, 21st, 2019 - In Power Electronics News, Nexperia’s advanced LFPAK MOSFETs’ characteristics and applications are detailed. Find out how LFPAK88 and other members of the LFPAK family bring value to Industrial and Automotive designs, by minimizing footprint and increasing power density.
Read the article in: Power Electronics News
May 17th, 2019 – Nexperia achieves higher power density through packaging. Read more about the LFPAK technology that was presented at PCIM trade show in Nuremberg.
Read the article in: EEWorld / Power electronic tips
March 26th, 2019 – Interview with Paul Zhang (Nexperia’s SVP of Sales Greater China & General Manager of China) at the company’s first presence at Electronica China in Shanghai. Read about what Paul says about Nexperia’s strong performance in its first 2 years, the management strategy for future growth and business development in China.
Read the article in: AET China (Chinese)
March 3rd, 2019 – To achieve a highly efficient design we try to utilize the most ideal solution possible. Nexperia’s Trench Schottky rectifiers take us close to that ideal solution by demonstrating low losses, stability against thermal runaway and an excellent EMC performance.
February 7th, 2019 – In just two years as independent company, Nexperia significantly out-performed the market, achieved growth figures of over 35%, introduced more new products and expanded its annual manufacturing capacity to more than 100 billion parts.
November 29th, 2018 – EETimes Japan interview with CEO Frans Scheper and Kazunari Kuniyoshi, Head & Senior Director Sales Japan about Nexperia’s strong performance in its first 18 months, the management strategy for future growth and business development in Japan. Read about the importance of capital investments, the automotive market and Nexperia’s ambitions in the area of power discretes.
October 25th, 2018 - The Chinese Wingtech Technology wants to acquire the majority of Nexperia, which was spun off from NXP last year. Through the purchase Wingtech wants to gain access to the automotive market, the largest business area of Nexperia.
August 3rd, 2018 - Double data rates and no expenditure required to replace USB Type-C cables should mean that USB 3.2 is a dream come true. It mostly is, but the fast, convenient USB upgrade does present some design challenges. Read about USB 3.2 / USB Type-C and how Nexperia is providing optimized ESD and surge protection solutions for these new standards.
On February 28, Nexperia CEO Frans Scheper had an interview on Dutch Business News Radio. Worth listening!