Wingtech automotive 4G module realized with Nexperia efficiency

The WM418, Wingtech’s first dedicated 4G vehicle communication module, draws on Nexperia’s automotive portfolio and packaging technologies, and opens the way to joint 5G + V2X developments.

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Towards 5G Mobility: The Role Of Efficient Discrete Semiconductors

Jan 27th, 2020 – This article explains the technical requirements of 5G and describes new components that enable Vehicle-to-Everything connectivity in smart cars. Read part 3 of the series about ADAS and Autonomous Vehicles and learn how another upcoming technological development is impacted by the performance of semiconductors.

Read in: Wevolver platform

New dynamics in GaN semiconductors – Big leap in sales expected

Jan 27th, 2020 – Since the end of 2019, every top ten manufacturer of Silicon-based power MOSFETs has either already had its own GaN power semiconductors on the market or has a clearly communicated strategy of how it will be added. Read more about the growing market and how the example of Nexperia shows that GaN technology meets the requirements of the automotive industry.

Read in: (GER)

Nexperia gets new owner

Dec 24th, 2019 – Nexperia announced that Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has officially obtained a controlling stake in Nexperia. Read about how the new investor opens up opportunities.

Read in: Electronics Weekly

Putting High-Performance Computing Into Cars: Automotive Discrete Semiconductors For Autonomous Driving

Dec 11th, 2019 – Reliable, small, and lightweight hardware that meets increasing performance requirements is today’s engineering challenge in the automotive industry. Dive into part 2 of the series about ADAS and Autonomous Vehicles and how new semiconductor products can increase reliability and performance.

Read in: Wevolver platform 

Nexperia joins the GaN FET market for high voltage applications

Nov 19th, 2019 – Nexperia announced its entry into the gallium nitride (GaN) FET market with the introduction of the 650 volt GAN063-650WSA. Read more about this strategic step and the new product.

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How Advanced Driver-Assistance Systems (ADAS) Impact Automotive Semiconductors

Nov 12th, 2019 – As the amount of advanced driver-assistance systems (ADAS) in vehicles increase, so does the requirement to innovate semiconductors to increase safety, reduce size, and complexity. This article is part of a series about ADAS and Autonomous Vehicles.

Read in: Wevolver platform

MOSFET Qrr: Ignore at your peril in the pursuit of power efficiency

Sep 6th, 2019 – Technical article exploring the significance of the parameter reverse recovery charge Qrr.

Read in: EDN (English) or EETimes China (Chinese)

Combination or Configurable Logic: When to Use Which and How?

Aug 20th, 2019 - Combination and configurable logic devices provide the flexibility to implement various logic functions with a reduced pin count, can lower system cost, simplify inventory & assembly, and improve the qualification process. Find out how to design more with less.

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Constant Current LED Drivers: Cost Efficient, Reliable, and Easy to Use

Aug 16th, 2019 – LEDs are widely used across all market segments. The vast majority of applications use LEDs with currents below 500 mA. This technical article discusses design and power considerations necessary to use constant-current LED drivers.

Read in: EEPower or EEPW (Chinese)

Continental Automotive honors outstanding series suppliers as “Supplier of the Year 2018”

July 26th, 2019 – The Supplier of the Year Award is given to those who have made an outstanding contribution to customer satisfaction at all levels – quality, technology, engagement, costs and purchasing conditions. Read more about the background and the 14 product categories in which the Continental awards were presented. Nexperia is proud winner in the category Electronics (discretes).

Read the article in: Automotive World or Automobilwoche (German)

Nexperia Honored with Bosch Global Supplier Award

July 11th, 2019 – Nexperia received a Bosch Global Supplier Award in the category ‘Purchasing of direct materials – Mobility Solutions’. Nexperia was one of only 47 companies from Bosch’s 43,000-strong supplier base to be honored with such an award for its outstanding performance and teamwork in 2017-2018.

Read in: EEPower

Advanced LFPAK MOSFETs technology for a higher power density

June, 21st, 2019 - In Power Electronics News, Nexperia’s advanced LFPAK MOSFETs’ characteristics and applications are detailed. Find out how LFPAK88 and other members of the LFPAK family bring value to Industrial and Automotive designs, by minimizing footprint and increasing power density.

Read the article in: Power Electronics News

Nexperia: Power technology on display at PCIM Nuremberg

May 17th, 2019 – Nexperia achieves higher power density through packaging. Read more about the LFPAK technology that was presented at PCIM trade show in Nuremberg.

Read the article in: EEWorld / Power electronic tips

Nexperia has achieved great results – first company presence at Electronica China trade show

March 26th, 2019 – Interview with Paul Zhang (Nexperia’s SVP of Sales Greater China & General Manager of China) at the company’s first presence at Electronica China in Shanghai. Read about what Paul says about Nexperia’s strong performance in its first 2 years, the management strategy for future growth and business development in China.

Read the article in: AET China (Chinese)

Why Trench Schottky rectifiers are the preferred choice

March 3rd, 2019 – To achieve a highly efficient design we try to utilize the most ideal solution possible. Nexperia’s Trench Schottky rectifiers take us close to that ideal solution by demonstrating low losses, stability against thermal runaway and an excellent EMC performance.

Read the article in: EETimes China (Chinese) or EEPower (English)

Nexperia Achieves 35% Revenue Growth in First Two Years as a Standalone Company

February 7th, 2019 – In just two years as independent company, Nexperia significantly out-performed the market, achieved growth figures of over 35%, introduced more new products and expanded its annual manufacturing capacity to more than 100 billion parts.

Read the article in: Global Banking and Finance, Elektronik (German), Electronique (French), ESM (Chinese)

Nexperia aims to increase sales by 20% in 2019

November 29th, 2018 – EETimes Japan interview with CEO Frans Scheper and Kazunari Kuniyoshi, Head & Senior Director Sales Japan about Nexperia’s strong performance in its first 18 months, the management strategy for future growth and business development in Japan. Read about the importance of capital investments, the automotive market and Nexperia’s ambitions in the area of power discretes.

Read the article in: EETimes Japan

Company value almost doubled. Wingtech buys majority stake in Nexperia

October 25th, 2018 - The Chinese Wingtech Technology wants to acquire the majority of Nexperia, which was spun off from NXP last year. Through the purchase Wingtech wants to gain access to the automotive market, the largest business area of ​​Nexperia.

Read the article in: Markt & Technik

Design Challenges Posed by USB 3.2

August 3rd, 2018 - Double data rates and no expenditure required to replace USB Type-C cables should mean that USB 3.2 is a dream come true. It mostly is, but the fast, convenient USB upgrade does present some design challenges. Read about USB 3.2 / USB Type-C and how Nexperia is providing optimized ESD and surge protection solutions for these new standards.

Read the article in: Embedded Systems Engineering powered by EECatalog

Interview with Nexperia CEO Frans Scheper on Dutch Business News Radio

On February 28, Nexperia CEO Frans Scheper had an interview on Dutch Business News Radio. Worth listening! 

Watch the interview with Frans