Feb. 16th, 2021 – With the advance of power application technology, extremely high levels of currents are being required. These applications have reached power level requirements at which the implementation of one MOSFET is no longer sufficient, forcing designers to resort to placing MOSFETs in parallel. This article discusses current-sharing technology in parallel MOSFET applications.
Read in: Power Electronics News
Jan. 28th, 2021 – Automotive Ethernet will be the solution to handle data payload but new ESD protection devices are required to ensure safety. Read this article and learn how System-Efficient ESD Design (SEED) modelling helps develop automotive Ethernet ESD protection that meets Open Alliance specifications.
Read in: Power Systems Design
Jan. 28th, 2021 – Nexperia has developed a new rectifier technology based on silicon germanium (SiGe) for applications in the 100-200V range. These new power diodes combine the efficiency of silicon Schottky rectifiers with the thermal stability of Fast Recovery rectifiers, enabling engineers to optimize power designs for high efficiency.
Read in Power Electronics News
Dec. 26th, 2020 – Paul Zhang, SVP Sales & Marketing and General Manager of China gives Elecfans 电子发烧友 an outlook on the three major opportunities in 2021, namely vehicle electrification, smart driving and 5G communications. He discusses the advantages of Nexperia’s industrial footprint and how the company plans to expand production capacity.
Read in: Elefans 电子发烧友
Oct. 15th, 2020 – Interview with two of Nexperia’s youngest executives (Mark Roeloffzen and Robby Ferdinandus) describe the journey, motivations, and lessons from their rapidly developing careers in the semiconductor industry. In Part 2 of the interview they detail the key innovations in the semiconductor industry and share Nexperia’s vision for the future.
Read in: Wevolver
August 1st, 2020 – Cover story discussing product robustness, quality and reliability issues at high voltage and high temperatures, for Nexperia’s latest 650 V power GaN FET technology which is now qualified in accordance with AEC-Q101 automotive standard.
Read in: Power Electronics Europe
June 25th, 2020 – 650 V GaN FETs, SiGe rectifiers and a further expansion of the AEC-Q101-qualified diode and transistor program are among the latest innovations in the power semiconductor sector at Nexperia.
Read in: Markt & Technik
June 6th, 2020 – This article looks at Nexperia’s second generation GaN technology and the roadmap for electric vehicles and industrial power supplies.
Read in: EENews
The WM418, Wingtech’s first dedicated 4G vehicle communication module, draws on Nexperia’s automotive portfolio and packaging technologies, and opens the way to joint 5G + V2X developments.
Jan 27th, 2020 – This article explains the technical requirements of 5G and describes new components that enable Vehicle-to-Everything connectivity in smart cars. Read part 3 of the series about ADAS and Autonomous Vehicles and learn how another upcoming technological development is impacted by the performance of semiconductors.
Read in: Wevolver platform
Jan 27th, 2020 – Since the end of 2019, every top ten manufacturer of Silicon-based power MOSFETs has either already had its own GaN power semiconductors on the market or has a clearly communicated strategy of how it will be added. Read more about the growing market and how the example of Nexperia shows that GaN technology meets the requirements of the automotive industry.
Read in: Elektroniknet.de (GER)
Dec 24th, 2019 – Nexperia announced that Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has officially obtained a controlling stake in Nexperia. Read about how the new investor opens up opportunities.
Read in: Electronics Weekly
Dec 11th, 2019 – Reliable, small, and lightweight hardware that meets increasing performance requirements is today’s engineering challenge in the automotive industry. Dive into part 2 of the series about ADAS and Autonomous Vehicles and how new semiconductor products can increase reliability and performance.
Read in: Wevolver platform
Nov 19th, 2019 – Nexperia announced its entry into the gallium nitride (GaN) FET market with the introduction of the 650 volt GAN063-650WSA. Read more about this strategic step and the new product.
Read in: PowerPulse.net
Nov 12th, 2019 – As the amount of advanced driver-assistance systems (ADAS) in vehicles increase, so does the requirement to innovate semiconductors to increase safety, reduce size, and complexity. This article is part of a series about ADAS and Autonomous Vehicles.
Read in: Wevolver platform
Sep 6th, 2019 – Technical article exploring the significance of the parameter reverse recovery charge Qrr.
Aug 20th, 2019 - Combination and configurable logic devices provide the flexibility to implement various logic functions with a reduced pin count, can lower system cost, simplify inventory & assembly, and improve the qualification process. Find out how to design more with less.
Read in: PowerPulse.net
Aug 16th, 2019 – LEDs are widely used across all market segments. The vast majority of applications use LEDs with currents below 500 mA. This technical article discusses design and power considerations necessary to use constant-current LED drivers.
July 26th, 2019 – The Supplier of the Year Award is given to those who have made an outstanding contribution to customer satisfaction at all levels – quality, technology, engagement, costs and purchasing conditions. Read more about the background and the 14 product categories in which the Continental awards were presented. Nexperia is proud winner in the category Electronics (discretes).
July 11th, 2019 – Nexperia received a Bosch Global Supplier Award in the category ‘Purchasing of direct materials – Mobility Solutions’. Nexperia was one of only 47 companies from Bosch’s 43,000-strong supplier base to be honored with such an award for its outstanding performance and teamwork in 2017-2018.
Read in: EEPower
June, 21st, 2019 - In Power Electronics News, Nexperia’s advanced LFPAK MOSFETs’ characteristics and applications are detailed. Find out how LFPAK88 and other members of the LFPAK family bring value to Industrial and Automotive designs, by minimizing footprint and increasing power density.
Read the article in: Power Electronics News
May 17th, 2019 – Nexperia achieves higher power density through packaging. Read more about the LFPAK technology that was presented at PCIM trade show in Nuremberg.
Read the article in: EEWorld / Power electronic tips
March 26th, 2019 – Interview with Paul Zhang (Nexperia’s SVP of Sales Greater China & General Manager of China) at the company’s first presence at Electronica China in Shanghai. Read about what Paul says about Nexperia’s strong performance in its first 2 years, the management strategy for future growth and business development in China.
Read the article in: AET China (Chinese)
March 3rd, 2019 – To achieve a highly efficient design we try to utilize the most ideal solution possible. Nexperia’s Trench Schottky rectifiers take us close to that ideal solution by demonstrating low losses, stability against thermal runaway and an excellent EMC performance.
February 7th, 2019 – In just two years as independent company, Nexperia significantly out-performed the market, achieved growth figures of over 35%, introduced more new products and expanded its annual manufacturing capacity to more than 100 billion parts.
November 29th, 2018 – EETimes Japan interview with CEO Frans Scheper and Kazunari Kuniyoshi, Head & Senior Director Sales Japan about Nexperia’s strong performance in its first 18 months, the management strategy for future growth and business development in Japan. Read about the importance of capital investments, the automotive market and Nexperia’s ambitions in the area of power discretes.
October 25th, 2018 - The Chinese Wingtech Technology wants to acquire the majority of Nexperia, which was spun off from NXP last year. Through the purchase Wingtech wants to gain access to the automotive market, the largest business area of Nexperia.
August 3rd, 2018 - Double data rates and no expenditure required to replace USB Type-C cables should mean that USB 3.2 is a dream come true. It mostly is, but the fast, convenient USB upgrade does present some design challenges. Read about USB 3.2 / USB Type-C and how Nexperia is providing optimized ESD and surge protection solutions for these new standards.
On February 28, Nexperia CEO Frans Scheper had an interview on Dutch Business News Radio. Worth listening!