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Chemical content 74AHC08PW

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Type numberPackagePackage descriptionTotal product weight
74AHC08PWSOT402-1TSSOP1451.79255 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352626791181512601235Suzhou, China; Shanghai, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.06016
PolymerAcrylic resinProprietary0.0060815.200000.01174
Resin systemProprietary0.002766.900000.00533
subTotal0.04000100.000000.07723
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.29175
subTotal0.15110100.000000.29175
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.77293
Iron (Fe)7439-89-60.468962.400000.90546
Phosphorus (P)7723-14-00.005860.030000.01132
Zinc (Zn)7440-66-60.019540.100000.03773
subTotal19.54000100.0000037.72744
Mould CompoundAdditiveNon hazardousProprietary1.488964.700002.87485
FillerSilica fused60676-86-025.0272079.0000048.32201
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.900806.000003.67003
PigmentCarbon black1333-86-40.063360.200000.12233
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.267204.000002.44668
Non hazardousProprietary1.298884.100002.50785
Tetramethylbiphenyl diglycidyl ether85954-11-60.633602.000001.22334
subTotal31.68000100.0000061.16709
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00560
Nickel (Ni)7440-02-00.2813097.000000.54313
Palladium (Pd)7440-05-30.005802.000000.01120
subTotal0.29000100.000000.55993
WirePure metalCopper (Cu)7440-50-80.09145100.000000.17657
subTotal0.09145100.000000.17657
total51.79255100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.