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Chemical content 74AHC30BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC30BQSOT762-1DHVQFN1421.76142 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935289764115812601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0945280.100000.43434
PolymerResin systemProprietary0.0234819.900000.10791
subTotal0.11800100.000000.54225
DieDoped siliconSilicon (Si)7440-21-30.15647100.000000.71903
subTotal0.15647100.000000.71903
Lead FrameCopper alloyCopper (Cu)7440-50-88.4266896.1950038.72303
Iron (Fe)7439-89-60.205522.346100.94442
Phosphorus (P)7723-14-00.002650.030200.01216
Zinc (Zn)7440-66-60.008890.101500.04086
Pure metal layerGold (Au)7440-57-50.002650.030200.01216
Nickel (Ni)7440-02-00.106921.220500.49131
Palladium (Pd)7440-05-30.004910.056000.02254
Silver (Ag)7440-22-40.001800.020500.00825
subTotal8.76000100.0000040.25473
Mould CompoundAdditiveNon hazardousProprietary0.369162.910001.69641
FillerSilica -amorphous-7631-86-90.442743.490002.03452
Silica fused60676-86-010.7602784.8200049.44652
PigmentCarbon black1333-86-40.020300.160000.09327
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.137011.080000.62959
Epoxy resin systemProprietary0.201711.590000.92690
Phenolic resinProprietary0.285442.250001.31166
Tetramethylbiphenyl diglycidyl ether85954-11-60.469383.700002.15695
subTotal12.68600100.0000058.29582
WirePure metalCopper (Cu)7440-50-80.0395496.550000.18168
Pure metal layerGold (Au)7440-57-50.000140.350000.00066
Palladium (Pd)7440-05-30.001273.100000.00583
subTotal0.04095100.000000.18817
total21.76142100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.