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Chemical content 74AHCT1G08GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHCT1G08GV-Q100SOT753SO510.40392 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298624125612601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07209
PolymerResin systemProprietary0.0025025.000000.02403
subTotal0.01000100.000000.09612
DieDoped siliconSilicon (Si)7440-21-30.08038100.000000.77264
subTotal0.08038100.000000.77264
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.66783
Iron (Fe)7439-89-60.085682.550000.82354
Lead (Pb)7439-92-10.001010.030000.00969
Phosphorus (P)7723-14-00.005040.150000.04844
Tin (Sn)7440-31-50.006720.200000.06459
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68144
subTotal3.36000100.0000032.29553
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.22179
PigmentCarbon black1333-86-40.019440.300000.18685
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.26999
Phenolic resinProprietary0.583209.000005.60558
subTotal6.48000100.0000062.28421
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.22875
subTotal0.44000100.000004.22917
WireGold alloyGold (Au)7440-57-50.0332099.000000.31911
Palladium (Pd)7440-05-30.000341.000000.00322
subTotal0.03354100.000000.32233
total10.40392100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.