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Chemical content 74AUP1G06GN

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Type numberPackagePackage descriptionTotal product weight
74AUP1G06GNSOT1115X2SON60.86766 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291715132612601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000003.62527
subTotal0.03146100.000003.62527
ComponentAdditiveNon hazardousProprietary0.000255.000000.02881
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02881
Silica -amorphous-7631-86-90.0025050.000000.28813
PolymerEpoxy resin systemProprietary0.0015030.000000.17288
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05763
subTotal0.00500100.000000.57626
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100041.93618
Magnesium (Mg)7439-95-40.000580.150000.06656
Nickel (Ni)7440-02-00.011362.950001.30898
Silicon (Si)7440-21-30.002460.640000.28398
Pure metal layerGold (Au)7440-57-50.000080.020000.00887
Nickel (Ni)7440-02-00.006311.640000.72770
Palladium (Pd)7440-05-30.000350.090000.03993
subTotal0.38500100.0000044.37220
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20555
FillerSilica -amorphous-7631-86-90.001260.290000.14539
Silica fused60676-86-00.3747586.1500043.19117
HardenerPhenolic resinProprietary0.018664.290002.15078
PigmentCarbon black1333-86-40.000830.190000.09526
PolymerEpoxy resin systemProprietary0.037718.670004.34669
subTotal0.43500100.0000050.13484
WireGold alloyGold (Au)7440-57-50.0111099.000001.27906
Palladium (Pd)7440-05-30.000111.000000.01292
subTotal0.01121100.000001.29198
total0.86766100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.