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Chemical content 74AUP1G06GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1G06GSSOT1202X2SON60.95900 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292828132612601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000003.27998
subTotal0.03146100.000003.27998
ComponentAdditiveNon hazardousProprietary0.000255.000000.02607
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02607
Silica -amorphous-7631-86-90.0025050.000000.26069
PolymerEpoxy resin systemProprietary0.0015030.000000.15641
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05214
subTotal0.00500100.000000.52138
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.48979
Magnesium (Mg)7439-95-40.000630.150000.06585
Nickel (Ni)7440-02-00.012422.950001.29505
Silicon (Si)7440-21-30.002690.640000.28096
Pure metal layerGold (Au)7440-57-50.000080.020000.00878
Nickel (Ni)7440-02-00.006901.640000.71996
Palladium (Pd)7440-05-30.000380.090000.03951
subTotal0.42100100.0000043.89990
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20992
FillerSilica -amorphous-7631-86-90.001420.290000.14848
Silica fused60676-86-00.4230086.1500044.10808
HardenerPhenolic resinProprietary0.021064.290002.19644
PigmentCarbon black1333-86-40.000930.190000.09728
PolymerEpoxy resin systemProprietary0.042578.670004.43897
subTotal0.49100100.0000051.19917
WireGold alloyGold (Au)7440-57-50.0104499.000001.08910
Palladium (Pd)7440-05-30.000111.000000.01100
subTotal0.01055100.000001.10010
total0.95900100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.