×

Chemical content 74AUP1G07GX4

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G07GX4SOT1269-2X2SON40.36986 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935340115147612601235Shanghai, China; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.01820100.000004.92065
subTotal0.01820100.000004.92065
ComponentAdditiveNon hazardousProprietary0.000105.000000.02704
FillerBisphenol A-epichlorohydrin resin25068-38-60.000105.000000.02704
Silica -amorphous-7631-86-90.0010050.000000.27037
PolymerEpoxy resin systemProprietary0.0006030.000000.16222
Phenol Formaldehyde resin (generic)9003-35-40.0002010.000000.05407
subTotal0.00200100.000000.54074
Lead FrameCopper alloyCopper (Cu)7440-50-80.1309793.5479035.40990
Magnesium (Mg)7439-95-40.000200.145900.05523
Nickel (Ni)7440-02-00.004082.917301.10426
Silicon (Si)7440-21-30.000880.632100.23926
Pure metal layerGold (Au)7440-57-50.000080.058300.02207
Nickel (Ni)7440-02-00.003522.517200.95281
Palladium (Pd)7440-05-30.000250.181300.06863
subTotal0.14000100.0000037.85216
Mould CompoundAdditiveNon hazardousProprietary0.000840.410000.22614
FillerSilica -amorphous-7631-86-90.000590.290000.15995
Silica fused60676-86-00.1757586.1500047.51690
HardenerPhenolic resinProprietary0.008754.290002.36619
PigmentCarbon black1333-86-40.000390.190000.10480
PolymerEpoxy resin systemProprietary0.017698.670004.78203
subTotal0.20400100.0000055.15601
WireImpurityNon hazardousProprietary0.000000.010000.00015
Pure metalCopper (Cu)7440-50-80.0054696.490001.47693
Pure metal layerGold (Au)7440-57-50.000030.500000.00765
Palladium (Pd)7440-05-30.000173.000000.04592
subTotal0.00566100.000001.53065
total0.36986100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.