Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 74AUP1G08GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G08GFSOT891XSON61.20618 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93528110913219126030 s124020 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.06291100.000005.21564
subTotal0.06291100.000005.21564
ComponentAdditiveNon hazardousProprietary0.001505.000000.12436
FillerAluminium Trioxide (Al2O3)1344-28-10.0120040.000000.99488
PolymerBisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0045015.000000.37308
Bisphenol-A/Epichlorohydrin Epoxy resin (generic)25068-38-60.0030010.000000.24872
Resin systemProprietary0.0090030.000000.74616
subTotal0.03000100.000002.48720
Lead FrameCopper alloyCopper (Cu)7440-50-80.4670093.4000038.71727
Magnesium (Mg)7439-95-40.000750.150000.06218
Nickel (Ni)7440-02-00.014552.910001.20629
Silicon (Si)7440-21-30.003150.630000.26116
Pure metal layerGold (Au)7440-57-50.000200.040000.01658
Nickel (Ni)7440-02-00.013802.760001.14411
Palladium (Pd)7440-05-30.000550.110000.04560
subTotal0.50000100.0000041.45319
Mould CompoundFillerSilica -amorphous-7631-86-90.1160020.000009.61714
Silica fused60676-86-00.3741064.5000031.01527
Flame retardantMetal hydroxideProprietary0.017403.000001.44257
ImpuritySilicon Dioxide (SiO2)14808-60-70.002900.500000.24043
PigmentCarbon black1333-86-40.001740.300000.14426
PolymerPhenol Formaldehyde resin (generic)9003-35-40.012762.200001.05789
Phenolic resinProprietary0.014502.500001.20214
Tetramethylbiphenyl diglycidyl ether85954-11-60.040607.000003.36600
subTotal0.58000100.0000048.08570
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0200099.990001.65796
subTotal0.02000100.000001.65813
WireGold alloyGold (Au)7440-57-50.0131399.000001.08896
Palladium (Pd)7440-05-30.000131.000000.01100
subTotal0.01327100.000001.09996
total1.20618100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.