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Chemical content 74AUP1G58GM

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Type numberPackagePackage descriptionTotal product weight
74AUP1G58GMSOT886XSON61.90508 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935279961132812601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
935279961115912601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04510100.000002.36751
subTotal0.04510100.000002.36751
ComponentAdditiveNon hazardousProprietary0.000255.000000.01312
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01312
Silica -amorphous-7631-86-90.0025050.000000.13123
PolymerEpoxy resin systemProprietary0.0015030.000000.07874
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02625
subTotal0.00500100.000000.26246
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.29851
Magnesium (Mg)7439-95-40.001160.150000.06078
Nickel (Ni)7440-02-00.022772.950001.19544
Silicon (Si)7440-21-30.004940.640000.25935
Pure metal layerGold (Au)7440-57-50.000150.020000.00810
Nickel (Ni)7440-02-00.012661.640000.66458
Palladium (Pd)7440-05-30.000690.090000.03647
subTotal0.77200100.0000040.52323
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22942
FillerSilica -amorphous-7631-86-90.003090.290000.16227
Silica fused60676-86-00.9183686.1500048.20580
HardenerPhenolic resinProprietary0.045734.290002.40050
PigmentCarbon black1333-86-40.002030.190000.10632
PolymerEpoxy resin systemProprietary0.092428.670004.85136
subTotal1.06600100.0000055.95567
WireGold alloyGold (Au)7440-57-50.0168199.000000.88213
Palladium (Pd)7440-05-30.000171.000000.00891
subTotal0.01698100.000000.89104
total1.90508100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.