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Chemical content 74AUP1G86GS

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Type numberPackagePackage descriptionTotal product weight
74AUP1G86GSSOT1202X2SON60.96210 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292872132612601235Shanghai, China; Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.03146100.000003.26941
subTotal0.03146100.000003.26941
ComponentAdditiveNon hazardousProprietary0.000255.000000.02598
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02598
Silica -amorphous-7631-86-90.0025050.000000.25985
PolymerEpoxy resin systemProprietary0.0015030.000000.15591
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05197
subTotal0.00500100.000000.51969
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.35611
Magnesium (Mg)7439-95-40.000630.150000.06564
Nickel (Ni)7440-02-00.012422.950001.29087
Silicon (Si)7440-21-30.002690.640000.28005
Pure metal layerGold (Au)7440-57-50.000080.020000.00875
Nickel (Ni)7440-02-00.006901.640000.71764
Palladium (Pd)7440-05-30.000380.090000.03938
subTotal0.42100100.0000043.75844
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.20924
FillerSilica -amorphous-7631-86-90.001420.290000.14800
Silica fused60676-86-00.4230086.1500043.96596
HardenerPhenolic resinProprietary0.021064.290002.18937
PigmentCarbon black1333-86-40.000930.190000.09696
PolymerEpoxy resin systemProprietary0.042578.670004.42466
subTotal0.49100100.0000051.03419
WireGold alloyGold (Au)7440-57-50.0135099.000001.40355
Palladium (Pd)7440-05-30.000141.000000.01418
subTotal0.01364100.000001.41773
total0.96210100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.