×

Chemical content 74AUP1G885GF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP1G885GFSOT1089XSON81.78848 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935291472115812601235Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia; Ayutthaya, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10136100.000005.66710
subTotal0.10136100.000005.66710
ComponentAdditiveNon hazardousProprietary0.001005.000000.05591
FillerAluminium Trioxide (Al2O3)1344-28-10.0080040.000000.44731
PolymerBisphenol A-epichlorohydrin resin25068-38-60.0020010.000000.11183
Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer25036-25-30.0030015.000000.16774
Resin systemProprietary0.0060030.000000.33548
subTotal0.02000100.000001.11827
Lead FrameCopper alloyCopper (Cu)7440-50-80.6372495.1100035.63009
Magnesium (Mg)7439-95-40.001340.200000.07492
Nickel (Ni)7440-02-00.021243.170001.18754
Silicon (Si)7440-21-30.004620.690000.25849
Pure metal layerGold (Au)7440-57-50.000130.020000.00749
Nickel (Ni)7440-02-00.004960.740000.27722
Palladium (Pd)7440-05-30.000470.070000.02622
subTotal0.67000100.0000037.46197
Mould CompoundFillerSilica -amorphous-7631-86-90.2162023.0000012.08848
Silica fused60676-86-00.5640060.0000031.53516
Flame retardantMetal hydroxideProprietary0.028203.000001.57676
ImpurityBismuth (Bi)7440-69-90.004700.500000.26279
PigmentCarbon black1333-86-40.004700.500000.26279
PolymerEpoxy resin systemProprietary0.065807.000003.67910
Phenolic resinProprietary0.056406.000003.15352
subTotal0.94000100.0000052.55860
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00005
Bismuth (Bi)7440-69-90.000000.001000.00002
Copper (Cu)7440-50-80.000000.001000.00002
Lead (Pb)7439-92-10.000000.005000.00008
Tin solderTin (Sn)7440-31-50.0300099.990001.67723
subTotal0.03000100.000001.67740
WireGold alloyGold (Au)7440-57-50.0268699.000001.50176
Palladium (Pd)7440-05-30.000271.000000.01517
subTotal0.02713100.000001.51693
total1.78848100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.