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Chemical content 74AUP1G885GT

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Type numberPackagePackage descriptionTotal product weight
74AUP1G885GTSOT833-1XSON82.50235 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352807671151812601235Ayutthaya, Thailand; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10136100.000004.05039
subTotal0.10136100.000004.05039
ComponentAdditiveNon hazardousProprietary0.000755.000000.02997
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02997
Silica -amorphous-7631-86-90.0075050.000000.29972
PolymerEpoxy resin systemProprietary0.0045030.000000.17983
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05994
subTotal0.01500100.000000.59943
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.32077
Magnesium (Mg)7439-95-40.001530.145700.06131
Nickel (Ni)7440-02-00.030682.914001.22622
Silicon (Si)7440-21-30.006650.631400.26570
Pure metal layerGold (Au)7440-57-50.000370.035000.01473
Nickel (Ni)7440-02-00.028562.712001.14122
Palladium (Pd)7440-05-30.001260.120000.05050
subTotal1.05300100.0000042.08045
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21333
FillerSilica -amorphous-7631-86-90.003780.290000.15089
Silica fused60676-86-01.1216786.1500044.82478
HardenerPhenolic resinProprietary0.055864.290002.23213
PigmentCarbon black1333-86-40.002470.190000.09886
PolymerEpoxy resin systemProprietary0.112888.670004.51110
subTotal1.30200100.0000052.03109
WireGold alloyGold (Au)7440-57-50.0306999.000001.22625
Palladium (Pd)7440-05-30.000311.000000.01239
subTotal0.03099100.000001.23864
total2.50235100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.