×

Chemical content 74AUP2G08GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AUP2G08GTSOT833-1XSON82.50646 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352807121152012601235Ayutthaya, Thailand; Bangkok, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10136100.000004.04375
subTotal0.10136100.000004.04375
ComponentAdditiveNon hazardousProprietary0.000755.000000.02992
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.02992
Silica -amorphous-7631-86-90.0075050.000000.29923
PolymerEpoxy resin systemProprietary0.0045030.000000.17954
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.05985
subTotal0.01500100.000000.59846
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.25629
Magnesium (Mg)7439-95-40.001530.145700.06121
Nickel (Ni)7440-02-00.030682.914001.22421
Silicon (Si)7440-21-30.006650.631400.26526
Pure metal layerGold (Au)7440-57-50.000370.035000.01470
Nickel (Ni)7440-02-00.028562.712001.13935
Palladium (Pd)7440-05-30.001260.120000.05041
subTotal1.05300100.0000042.01143
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21298
FillerSilica -amorphous-7631-86-90.003780.290000.15064
Silica fused60676-86-01.1216786.1500044.75128
HardenerPhenolic resinProprietary0.055864.290002.22847
PigmentCarbon black1333-86-40.002470.190000.09870
PolymerEpoxy resin systemProprietary0.112888.670004.50370
subTotal1.30200100.0000051.94577
WireGold alloyGold (Au)7440-57-50.0347599.000001.38638
Palladium (Pd)7440-05-30.000351.000000.01400
subTotal0.03510100.000001.40038
total2.50646100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.