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Chemical content 74AVC1T8128GS

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Type numberPackagePackage descriptionTotal product weight
74AVC1T8128GSSOT1203X2SON81.33202 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690695115512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000003.57629
subTotal0.04764100.000003.57629
ComponentAdditiveNon hazardousProprietary0.000305.000000.02252
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02252
Silica -amorphous-7631-86-90.0030050.000000.22522
PolymerEpoxy resin systemProprietary0.0018030.000000.13513
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04504
subTotal0.00600100.000000.45043
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.86858
Magnesium (Mg)7439-95-40.000860.150000.06486
Nickel (Ni)7440-02-00.016992.950001.27566
Silicon (Si)7440-21-30.003690.640000.27675
Pure metal layerGold (Au)7440-57-50.000120.020000.00865
Nickel (Ni)7440-02-00.009451.640000.70918
Palladium (Pd)7440-05-30.000520.090000.03892
subTotal0.57600100.0000043.24260
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.21023
FillerSilica -amorphous-7631-86-90.001980.290000.14870
Silica fused60676-86-00.5884086.1500044.17385
HardenerPhenolic resinProprietary0.029304.290002.19972
PigmentCarbon black1333-86-40.001300.190000.09742
PolymerEpoxy resin systemProprietary0.059228.670004.44559
subTotal0.68300100.0000051.27551
WireGold alloyGold (Au)7440-57-50.0191999.000001.44038
Palladium (Pd)7440-05-30.000191.000000.01455
subTotal0.01938100.000001.45493
total1.33202100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.