×

Chemical content 74AVCH2T45GS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AVCH2T45GSSOT1203X2SON81.33448 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935292794115612601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04764100.000003.56969
subTotal0.04764100.000003.56969
ComponentAdditiveNon hazardousProprietary0.000305.000000.02248
FillerBisphenol A-epichlorohydrin resin25068-38-60.000305.000000.02248
Silica -amorphous-7631-86-90.0030050.000000.22481
PolymerEpoxy resin systemProprietary0.0018030.000000.13488
Phenol Formaldehyde resin (generic)9003-35-40.0006010.000000.04496
subTotal0.00600100.000000.44961
Lead FrameCopper alloyCopper (Cu)7440-50-80.5443894.5100040.79324
Magnesium (Mg)7439-95-40.000860.150000.06474
Nickel (Ni)7440-02-00.016992.950001.27330
Silicon (Si)7440-21-30.003690.640000.27624
Pure metal layerGold (Au)7440-57-50.000120.020000.00863
Nickel (Ni)7440-02-00.009451.640000.70787
Palladium (Pd)7440-05-30.000520.090000.03885
subTotal0.57600100.0000043.16287
Mould CompoundAdditiveNon hazardousProprietary0.002800.410000.20984
FillerSilica -amorphous-7631-86-90.001980.290000.14842
Silica fused60676-86-00.5884086.1500044.09242
HardenerPhenolic resinProprietary0.029304.290002.19566
PigmentCarbon black1333-86-40.001300.190000.09724
PolymerEpoxy resin systemProprietary0.059228.670004.43739
subTotal0.68300100.0000051.18097
WireGold alloyGold (Au)7440-57-50.0216399.000001.62060
Palladium (Pd)7440-05-30.000221.000000.01637
subTotal0.02184100.000001.63697
total1.33448100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.