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Chemical content 74AVCH4T245BQ

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Type numberPackagePackage descriptionTotal product weight
74AVCH4T245BQSOT763-1DHVQFN1622.01692 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352845871151212601235Bangkok, Thailand; Shanghai, China; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29469
PolymerResin systemProprietary0.0161219.900000.07321
subTotal0.08100100.000000.36790
DieDoped siliconSilicon (Si)7440-21-30.32196100.000001.46233
subTotal0.32196100.000001.46233
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.60391
Iron (Fe)7439-89-60.237082.320001.07681
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03713
Zinc (Zn)7440-66-60.012260.120000.05570
Gold alloyGold (Au)7440-57-50.003060.029970.01391
Silver (Ag)7440-22-40.002040.019980.00927
ImpurityNon hazardousProprietary0.000130.001280.00059
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02318
Nickel (Ni)7440-02-00.130671.278720.59351
subTotal10.21900100.0000046.41424
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.49591
FillerSilica -amorphous-7631-86-90.395003.490001.79407
Silica fused60676-86-09.5999384.8200043.60250
PigmentCarbon black1333-86-40.018110.160000.08225
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55518
Epoxy resin systemProprietary0.179961.590000.81735
Phenolic resinProprietary0.254662.250001.15663
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.90202
subTotal11.31800100.0000051.40591
WirePure metalCopper (Cu)7440-50-80.0743096.550000.33748
Pure metal layerGold (Au)7440-57-50.000270.350000.00122
Palladium (Pd)7440-05-30.002393.100000.01084
subTotal0.07696100.000000.34954
total22.01692100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.