×

Chemical content 74AXP1G02GN

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AXP1G02GNSOT1115X2SON60.86377 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304051125612601235Singapore, Singapore; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.76397
subTotal0.02387100.000002.76397
ComponentAdditiveNon hazardousProprietary0.000255.000000.02894
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02894
Silica -amorphous-7631-86-90.0025050.000000.28943
PolymerEpoxy resin systemProprietary0.0015030.000000.17366
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05789
subTotal0.00500100.000000.57886
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.12504
Magnesium (Mg)7439-95-40.000580.150000.06686
Nickel (Ni)7440-02-00.011362.950001.31488
Silicon (Si)7440-21-30.002460.640000.28526
Pure metal layerGold (Au)7440-57-50.000080.020000.00891
Nickel (Ni)7440-02-00.006311.640000.73098
Palladium (Pd)7440-05-30.000350.090000.04011
subTotal0.38500100.0000044.57204
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20648
FillerSilica -amorphous-7631-86-90.001260.290000.14605
Silica fused60676-86-00.3747586.1500043.38568
HardenerPhenolic resinProprietary0.018664.290002.16047
PigmentCarbon black1333-86-40.000830.190000.09569
PolymerEpoxy resin systemProprietary0.037718.670004.36627
subTotal0.43500100.0000050.36064
WireGold alloyGold (Au)7440-57-50.0147599.000001.70775
Palladium (Pd)7440-05-30.000151.000000.01725
subTotal0.01490100.000001.72500
total0.86377100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.