×

Chemical content 74AXP1G04GS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AXP1G04GSSOT1202X2SON60.95275 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304056125712601235Bangkok, Thailand; Seremban, Malaysia; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.50584
subTotal0.02387100.000002.50584
ComponentAdditiveNon hazardousProprietary0.000255.000000.02624
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02624
Silica -amorphous-7631-86-90.0025050.000000.26240
PolymerEpoxy resin systemProprietary0.0015030.000000.15744
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05248
subTotal0.00500100.000000.52480
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.76196
Magnesium (Mg)7439-95-40.000630.150000.06628
Nickel (Ni)7440-02-00.012422.950001.30354
Silicon (Si)7440-21-30.002690.640000.28280
Pure metal layerGold (Au)7440-57-50.000080.020000.00884
Nickel (Ni)7440-02-00.006901.640000.72468
Palladium (Pd)7440-05-30.000380.090000.03977
subTotal0.42100100.0000044.18787
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.21129
FillerSilica -amorphous-7631-86-90.001420.290000.14945
Silica fused60676-86-00.4230086.1500044.39743
HardenerPhenolic resinProprietary0.021064.290002.21085
PigmentCarbon black1333-86-40.000930.190000.09792
PolymerEpoxy resin systemProprietary0.042578.670004.46809
subTotal0.49100100.0000051.53503
WireGold alloyGold (Au)7440-57-50.0117699.000001.23393
Palladium (Pd)7440-05-30.000121.000000.01246
subTotal0.01188100.000001.24639
total0.95275100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.