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Chemical content 74AXP1G04GX

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Type numberPackagePackage descriptionTotal product weight
74AXP1G04GXSOT1226-3X2SON50.60420 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304057125812601235Bangkok, Thailand; Seremban, Malaysia; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000003.95140
subTotal0.02387100.000003.95140
ComponentAdditiveNon hazardousProprietary0.000205.000000.03310
FillerBisphenol A-epichlorohydrin resin25068-38-60.000205.000000.03310
Silica -amorphous-7631-86-90.0020050.000000.33102
PolymerEpoxy resin systemProprietary0.0012030.000000.19861
Phenol Formaldehyde resin (generic)9003-35-40.0004010.000000.06620
subTotal0.00400100.000000.66203
Lead FrameCopper alloyCopper (Cu)7440-50-80.2391194.5100039.57469
Magnesium (Mg)7439-95-40.000380.150000.06281
Nickel (Ni)7440-02-00.007462.950001.23527
Silicon (Si)7440-21-30.001620.640000.26799
Pure metal layerGold (Au)7440-57-50.000050.020000.00837
Nickel (Ni)7440-02-00.004151.640000.68673
Palladium (Pd)7440-05-30.000230.090000.03769
subTotal0.25300100.0000041.87355
Mould CompoundAdditiveNon hazardousProprietary0.001280.410000.21172
FillerSilica -amorphous-7631-86-90.000900.290000.14975
Silica fused60676-86-00.2687986.1500044.48659
HardenerPhenolic resinProprietary0.013384.290002.21529
PigmentCarbon black1333-86-40.000590.190000.09811
PolymerEpoxy resin systemProprietary0.027058.670004.47706
subTotal0.31200100.0000051.63852
WireGold alloyGold (Au)7440-57-50.0112199.000001.85564
Palladium (Pd)7440-05-30.000111.000000.01874
subTotal0.01132100.000001.87438
total0.60420100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.