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Chemical content 74AXP1G125GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1G125GMSOT886XSON61.91341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935303214125912601235Bangkok, Thailand; Singapore, Singapore; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.04775100.000002.49548
subTotal0.04775100.000002.49548
ComponentAdditiveNon hazardousProprietary0.000255.000000.01307
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01307
Silica -amorphous-7631-86-90.0025050.000000.13066
PolymerEpoxy resin systemProprietary0.0015030.000000.07839
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02613
subTotal0.00500100.000000.26132
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.13178
Magnesium (Mg)7439-95-40.001160.150000.06052
Nickel (Ni)7440-02-00.022772.950001.19023
Silicon (Si)7440-21-30.004940.640000.25822
Pure metal layerGold (Au)7440-57-50.000150.020000.00807
Nickel (Ni)7440-02-00.012661.640000.66169
Palladium (Pd)7440-05-30.000690.090000.03631
subTotal0.77200100.0000040.34682
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22842
FillerSilica -amorphous-7631-86-90.003090.290000.16156
Silica fused60676-86-00.9183686.1500047.99593
HardenerPhenolic resinProprietary0.045734.290002.39005
PigmentCarbon black1333-86-40.002030.190000.10585
PolymerEpoxy resin systemProprietary0.092428.670004.83024
subTotal1.06600100.0000055.71205
WireGold alloyGold (Au)7440-57-50.0224399.000001.17243
Palladium (Pd)7440-05-30.000231.000000.01184
subTotal0.02266100.000001.18427
total1.91341100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.