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Chemical content 74AXP1G14GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1G14GMSOT886XSON61.90811 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304073125712601235Bangkok, Thailand; Seremban, Malaysia; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.04775100.000002.50241
subTotal0.04775100.000002.50241
ComponentAdditiveNon hazardousProprietary0.000255.000000.01310
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01310
Silica -amorphous-7631-86-90.0025050.000000.13102
PolymerEpoxy resin systemProprietary0.0015030.000000.07861
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02620
subTotal0.00500100.000000.26203
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.23769
Magnesium (Mg)7439-95-40.001160.150000.06069
Nickel (Ni)7440-02-00.022772.950001.19354
Silicon (Si)7440-21-30.004940.640000.25894
Pure metal layerGold (Au)7440-57-50.000150.020000.00809
Nickel (Ni)7440-02-00.012661.640000.66353
Palladium (Pd)7440-05-30.000690.090000.03641
subTotal0.77200100.0000040.45889
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22905
FillerSilica -amorphous-7631-86-90.003090.290000.16201
Silica fused60676-86-00.9183686.1500048.12925
HardenerPhenolic resinProprietary0.045734.290002.39669
PigmentCarbon black1333-86-40.002030.190000.10615
PolymerEpoxy resin systemProprietary0.092428.670004.84365
subTotal1.06600100.0000055.86680
WireGold alloyGold (Au)7440-57-50.0171999.000000.90096
Palladium (Pd)7440-05-30.000171.000000.00910
subTotal0.01736100.000000.91006
total1.90811100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.