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Chemical content 74AXP1G14GN

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Type numberPackagePackage descriptionTotal product weight
74AXP1G14GNSOT1115X2SON60.86033 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304074125812601235Singapore, Singapore; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.77502
subTotal0.02387100.000002.77502
ComponentAdditiveNon hazardousProprietary0.000255.000000.02906
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02906
Silica -amorphous-7631-86-90.0025050.000000.29059
PolymerEpoxy resin systemProprietary0.0015030.000000.17435
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05812
subTotal0.00500100.000000.58118
Lead FrameCopper alloyCopper (Cu)7440-50-80.3638694.5100042.29348
Magnesium (Mg)7439-95-40.000580.150000.06713
Nickel (Ni)7440-02-00.011362.950001.32013
Silicon (Si)7440-21-30.002460.640000.28640
Pure metal layerGold (Au)7440-57-50.000080.020000.00895
Nickel (Ni)7440-02-00.006311.640000.73390
Palladium (Pd)7440-05-30.000350.090000.04028
subTotal0.38500100.0000044.75027
Mould CompoundAdditiveNon hazardousProprietary0.001780.410000.20730
FillerSilica -amorphous-7631-86-90.001260.290000.14663
Silica fused60676-86-00.3747586.1500043.55916
HardenerPhenolic resinProprietary0.018664.290002.16911
PigmentCarbon black1333-86-40.000830.190000.09607
PolymerEpoxy resin systemProprietary0.037718.670004.38372
subTotal0.43500100.0000050.56199
WireGold alloyGold (Au)7440-57-50.0113599.000001.31873
Palladium (Pd)7440-05-30.000111.000000.01332
subTotal0.01146100.000001.33205
total0.86033100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.