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Chemical content 74AXP1G32GS

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Type numberPackagePackage descriptionTotal product weight
74AXP1G32GSSOT1202X2SON60.95641 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935304047125812601235Singapore, Singapore; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.02387100.000002.49625
subTotal0.02387100.000002.49625
ComponentAdditiveNon hazardousProprietary0.000255.000000.02614
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02614
Silica -amorphous-7631-86-90.0025050.000000.26139
PolymerEpoxy resin systemProprietary0.0015030.000000.15684
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.05228
subTotal0.00500100.000000.52279
Lead FrameCopper alloyCopper (Cu)7440-50-80.3978994.5100041.60215
Magnesium (Mg)7439-95-40.000630.150000.06603
Nickel (Ni)7440-02-00.012422.950001.29855
Silicon (Si)7440-21-30.002690.640000.28172
Pure metal layerGold (Au)7440-57-50.000080.020000.00880
Nickel (Ni)7440-02-00.006901.640000.72191
Palladium (Pd)7440-05-30.000380.090000.03962
subTotal0.42100100.0000044.01878
Mould CompoundAdditiveNon hazardousProprietary0.002010.410000.21049
FillerSilica -amorphous-7631-86-90.001420.290000.14888
Silica fused60676-86-00.4230086.1500044.22753
HardenerPhenolic resinProprietary0.021064.290002.20239
PigmentCarbon black1333-86-40.000930.190000.09754
PolymerEpoxy resin systemProprietary0.042578.670004.45099
subTotal0.49100100.0000051.33782
WireGold alloyGold (Au)7440-57-50.0153899.000001.60858
Palladium (Pd)7440-05-30.000161.000000.01625
subTotal0.01554100.000001.62483
total0.95641100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.