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Chemical content 74AXP1G97GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1G97GMSOT886XSON61.91740 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301603125812601235Seremban, Malaysia; Bangkok, Thailand; Singapore, Singapore 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped SiliconSilicon (Si)7440-21-30.04775100.000002.49028
subTotal0.04775100.000002.49028
ComponentAdditiveNon hazardousProprietary0.000255.000000.01304
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01304
Silica -amorphous-7631-86-90.0025050.000000.13038
PolymerEpoxy resin systemProprietary0.0015030.000000.07823
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02608
subTotal0.00500100.000000.26077
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100038.05243
Magnesium (Mg)7439-95-40.001160.150000.06039
Nickel (Ni)7440-02-00.022772.950001.18775
Silicon (Si)7440-21-30.004940.640000.25768
Pure metal layerGold (Au)7440-57-50.000150.020000.00805
Nickel (Ni)7440-02-00.012661.640000.66031
Palladium (Pd)7440-05-30.000690.090000.03624
subTotal0.77200100.0000040.26285
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22794
FillerSilica -amorphous-7631-86-90.003090.290000.16123
Silica fused60676-86-00.9183686.1500047.89606
HardenerPhenolic resinProprietary0.045734.290002.38507
PigmentCarbon black1333-86-40.002030.190000.10563
PolymerEpoxy resin systemProprietary0.092428.670004.82018
subTotal1.06600100.0000055.59611
WireGold alloyGold (Au)7440-57-50.0263999.000001.37626
Palladium (Pd)7440-05-30.000271.000000.01390
subTotal0.02666100.000001.39016
total1.91740100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.