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Chemical content 74AXP1T125GM

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Type numberPackagePackage descriptionTotal product weight
74AXP1T125GMSOT886XSON61.93619 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935306985125812601235Seremban, Malaysia; Singapore, Singapore; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07130100.000003.68239
subTotal0.07130100.000003.68239
ComponentAdditiveNon hazardousProprietary0.000255.000000.01291
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01291
Silica -amorphous-7631-86-90.0025050.000000.12912
PolymerEpoxy resin systemProprietary0.0015030.000000.07747
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02582
subTotal0.00500100.000000.25823
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.68314
Magnesium (Mg)7439-95-40.001160.150000.05981
Nickel (Ni)7440-02-00.022772.950001.17623
Silicon (Si)7440-21-30.004940.640000.25518
Pure metal layerGold (Au)7440-57-50.000150.020000.00797
Nickel (Ni)7440-02-00.012661.640000.65390
Palladium (Pd)7440-05-30.000690.090000.03588
subTotal0.77200100.0000039.87211
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22573
FillerSilica -amorphous-7631-86-90.003090.290000.15966
Silica fused60676-86-00.9183686.1500047.43124
HardenerPhenolic resinProprietary0.045734.290002.36193
PigmentCarbon black1333-86-40.002030.190000.10461
PolymerEpoxy resin systemProprietary0.092428.670004.77341
subTotal1.06600100.0000055.05658
WireGold alloyGold (Au)7440-57-50.0216899.000001.11952
Palladium (Pd)7440-05-30.000221.000000.01131
subTotal0.02189100.000001.13083
total1.93619100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.